Bonding

Bonding refers to the process of permanently or temporarily joining two or more substrates (wafers, dies, chips or components) so that they function as a single entity. In the context of semiconductor, MEMS, optics and microfabricated devices, bonding is a key enabling step for: MEMS‐sensor fabrication, 3D stacked memory and logic, Semiconductor Engineering, Power devices / high‐voltage devices, Optoelectronics and photonics, Temporary support for wafer thinning and packaging.