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We're actively recruiting for a range of roles across sales, engineering, IT and warehouse. Check our careers page to see open positions including apprenticeships. 

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Resources

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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Bonding

Bonding refers to the process of permanently or temporarily joining two or more substrates (wafers, dies, chips or components) so that they function as a single entity. In the context of semiconductor, MEMS, optics and microfabricated devices, bonding is a key enabling step for: MEMS‐sensor fabrication, 3D stacked memory and logic, Semiconductor Engineering, Power devices / high‐voltage devices, Optoelectronics and photonics, Temporary support for wafer thinning and packaging.

EVG®301

EVG®805

BONDSCALE

EVG®540

EVG®810 LT

EVG®560

ComBond

EVG®610 BA

EVG®520 IS

EVG®850 DB

EVG®820

EVG®850 LT

EVG®620 BA

SmartView NT

EVG®510

EVG®850 TB

EVG®320

EVG®6200 BA

GEMINI FB XT

EVG®501

GEMINI

Experience the Technology Firsthand

Discover the capabilities of our equipment partners — including EVG, scia Systems, Veeco, PPS and SSI — through live or online demonstrations from their dedicated application labs across Europe and the US. Whether you're exploring a specific process or evaluating a full solution, we can arrange tailored demos to match your requirements.

 

Contact us to schedule a demonstration