EVG®850 TB

The fully automated temporary bonding system streamlines the entire temporary bonding process, from adhesive application and baking to alignment and bonding of the device wafer to the carrier wafer, all within a single automated tool. Featuring a modular layout, consistent with all EVG’s fully automated tools, the system can be throughput-optimized based on specific process needs. Thanks to EVG’s open platform design, the system supports a variety of temporary bonding adhesives, including spin-coat thermoplastics, thermoset materials, and tapes, offering flexibility for diverse applications.

Features:

• Open adhesive platform
• Various carriers (silicon, glass, sapphire, etc…)
• Bridge tool capability for different substrate sizes
• Available with multiple load port options and combinations
• Recipe controlled system
• Real time monitoring and recording of all relevant process parameters
• Fully integrated SECS/GEM interface
• Optional integrated inline metrology module for automated feedback loop

Applications:

• Thin-Wafer Processing / Backside Processing        
  For wafers that need to be thinned, backside etched, or otherwise processed, the temporary bonding to a robust carrier gives mechanical support during those fragile steps.
  
  
• 3D IC / TSV Integration        
  In 3D stacking or through-silicon-via (TSV) processes, temporary bonding is often needed to maintain wafer integrity while interconnects are formed, and then debonding is done later.

• MEMS / Sensor Fabrication        
  MEMS devices with fragile membranes or features benefit from bonding to carrier while backside or postprocessing is done.
  
  
• Heterogeneous Integration        
  When combining different types of substrates or materials, temporary bonding helps ensure that processing steps do not damage delicate layers.
  
  
• Process Development / R&D        
  The flexibility (open adhesive platform, modular design) means researchers/developers can test different adhesive chemistries, bonding recipes, and carriers.
  
  
• High-Yield / High-Quality Thin Wafer Flows        
  The optional inline metrology allows monitoring of key parameters (e.g. adhesive thickness uniformity, voids, warp) to reduce defects and wafer breakage.