EVG®850 LT
Wafer bonding is a critical enabling technology for SOI wafer fabrication and wafer-level 3D integration. The EVG®850 LT automated production bonding system supports mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation. Combining all essential steps for fusion bonding—from cleaning and plasma activation to pre-bonding and IR inspection—the EVG®850 LT streamlines the process in a single system. Field-proven and industry-standard, the EVG®850 LT ensures a high-throughput, high-yield production process, delivering void-free bonds for reliable results.
Features:
- SOI and direct wafer bonding with EVG's LowTemp™ plasma activation
- Suitable for a wide range of fusion/molecular wafer bonding applications
- Production system built to operate in high-throughput, high-yield environments
- Automated cassette-to-cassette operation (ergo load, SMIF or FOUP)
- Contamination-free backside handling
- Megasonic and/or brush cleaning
- Pre-bonding with mechanical flat or notch alignment Advanced remote diagnostics
Applications:
- Silicon-on-Insulator (SOI) Wafer Fabrication
The EVG®850 LT is instrumental in producing SOI wafers by bonding a thin silicon layer onto an insulating substrate, a process vital for advanced semiconductor devices. - Direct Wafer Bonding
Facilitates direct bonding of wafers without the need for intermediate adhesives, enabling the creation of engineered substrates and layer transfer applications. - 3D Wafer-Level Integration
Supports wafer-level 3D integration by enabling the bonding of multiple wafer layers, essential for advanced packaging and heterogeneous integration. - Backside Illuminated (BSI) CMOS Image Sensors
Enables the fabrication of BSI CMOS image sensors by bonding wafers with precise alignment, enhancing the performance of imaging devices. - Advanced Substrate Bonding
Applicable in bonding various advanced substrates, including compound semiconductors and MEMS devices, for the development of next-generation electronic and photonic systems.