EVG®560

The EVG®560 is a highly configurable production bonder, designed to deliver high-yield bonds with enhanced process control and automation. It builds on the proven bond chamber design of EVG's manual bonding systems, incorporating key features for optimised performance. A robot handling system automates the loading and unloading of process chambers, streamlining operations for efficient, high-volume production.

Features:

• Fully automated processing with automated loading and unloading of bond chucks
• Up to four bond chambers for various bonding processes
• Compatible with EVG mechanical and optical aligner including SmartView
• Simultaneous rapid heating and cooling on top and bottom side
• Automatic loading and unloading of bond chambers and cooling station
• Remote online diagnostics

Applications:

• High-Volume / Production Bonding        
  In processes where bonding is a bottleneck, the automation and multi-chamber design help scale to production volumes.
  
  
• Wafer-Level Packaging / 3D Integration        
  Bonding wafers in packaging, stacking dies, heterogeneous integration, advanced packaging flows benefit from full automation and high throughput.
  
  
• MEMS / Sensor Packaging        
  MEMS devices often need wafer-level sealing or capping; the 560 allows integration of such bonding steps into high-volume manufacturing.
  
  
• Process Scaling & Transfer        
  Because bond chamber designs are compatible with those used in manual and semi-automated tools, processes developed earlier can be transferred or scaled to the 560.
  
  
• Flexible / Mixed Bonding Flows
  The multiple bond chamber concept allows different bonding modalities to run in parallel or change over as required (e.g. one chamber for eutectic, one for direct, etc.).
  
  
• High Reliability / Yield-Critical Bonds       
  The uniform thermal control and automation reduce process variability, improving bond uniformity, yield, and reproducibility.