EVG®620 BA

EVG®620 BA Use the EVG620 bond alignment system for wafer-to-wafer alignment for wafer sizes up to 150 mm. The tool benefits from the high precision manual alignment stage for which EVG bond alignment systems are recognised, is user-friendly and flexible. Thanks to the precision of this EVG bond alignment system, challenging alignment processes can be accommodated; such as 3D integration applications, and MEMS production.

Features:

• Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
• Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
• Manual or motorized alignment stage
• Fully motorized high-resolution bottom-side microscopes
• Windows® based user interface
• Quick tool change between different wafer sizes and different bonding applications
• Options Automatic alignment IR alignment for inner substrate key alignment
• NanoAlign® package for enhanced process capabilities
• Available with system rack
• Upgrade possibility to mask aligner

Applications:

• MEMS / Microdevice Bonding
  Aligning device wafers to capping wafers or membrane wafers prior to permanent bonding (e.g. sealing, encapsulation) in MEMS fabrication.
  
  
• 3D Integration / Wafer Stacking
  Alignment of wafers for 3D stacking before bonding so that interconnects or features align correctly.
  
  
• Pilot / R&D Bonding Flows
  In development labs or pilot fabs, EVG 620 BA offers higher automation and repeatability compared to manual bond aligners, but at lower cost and complexity relative to full production aligners.
  
  
• Bond Process Development / Recipe Tuning
  Useful for exploring alignment tolerances, overlay budget requirements, and bonding misalignment sensitivity before scaling to higher-volume systems.
  
  
• Small-run / Low-volume Bond Production
  For niche devices or low-volume production runs where throughput is moderate but alignment precision is important.