EVG®540

The EVG®540 is an automated single-chamber production bonder, designed for pilot-line manufacturing and R&D in wafer-level packaging, 3D interconnect, and MEMS applications. Built on a modular design, the EVG®540 offers a proven solution for seamlessly transitioning wafer bonding processes from R&D to large-scale manufacturing, integrating smoothly with EVG’s fully integrated production bonding systems.

Features

• Single-chamber bonder up to 300 mm substrate size
• Compatible with SmartView® and MBA300
• Automatic handling of up to four bond chucks
• Compliant to high safety standards

Applications:

• Wafer-Level Packaging & 3D Interconnects
  As devices move toward 3D stacking, interposer integration, and heterogeneous integration, the ability to bond large wafers with alignment and consistency is crucial. The 540 serves as a production-capable tool in such flows.
  
  
• MEMS & Sensor Packaging
  MEMS devices often require hermetic sealing or wafer capping, and bonding is key to packaging them. The 540 can support these in higher throughput compared to lab-scale bonders.
  
  
• Technology Transfer / Scale-Up
  Processes developed on smaller or semi-automated bonders (like EVG 501, 510, 520) can be ported to the 540 more directly, because of its more “production-like” automation and throughput.
  
  
• Pilot Manufacturing / Pre-Production Runs
  For small-volume devices or new product lines, the 540 provides a balance of automation, capacity, and flexibility.
  
  
• Integration with Alignment & Pre‑Processing Tools
  Because it’s compatible with EVG’s alignment (SmartView) and handling modules (MBA300), it can be part of an integrated wafer processing / bonding line.