GEMINI FB XT

Vertical stacking of semiconductor devices is an increasingly effective approach to advancing device density and performance. Wafer-to-wafer bonding is a critical process enabling 3D stacked devices.The EVG® GEMINI FB XT integrated fusion bonding system pushes the boundaries of current standards, offering higher productivity alongside enhanced alignment and overlay accuracy. It is ideal for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. Equipped with the SmartView bond aligner, the GEMINI FB XT is specifically designed to meet the demanding alignment requirements of fusion and hybrid wafer bonding.

Features:

• New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
• Up to six pre-processing modules like:
• Clean module LowTemp™ plasma activation module
• Alignment verification module
• Debond module XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
• Optional features:
• Debond module
• Thermocompression bond module

Applications:

• Memory Stacking
  The GEMINI® FB is utilized in stacking memory devices, enabling increased storage capacity and improved performance in semiconductor products.
  
  
• 3D Systems on Chip (SoC)
  It supports the integration of multiple functional layers into a single chip, enhancing device functionality and reducing form factor.
  
  
• Backside Illuminated (BSI) CMOS Image Sensors
  The system is employed in bonding processes for BSI CMOS image sensors, which are crucial for high-performance imaging applications.
  
  
• Die Partitioning
  It facilitates die partitioning, allowing for the separation of large die into smaller functional units, optimizing manufacturing processes.
  
  
• Collective Die-to-Wafer (Co-D2W) Bonding
  The GEMINI® FB is configured for Co-D2W bonding, enabling the transfer of multiple dies onto a wafer in a single process step, enhancing throughput and efficiency.