EVG®6200 BA

What is the EVG®6200∞ BA?

The EVG®6200∞ BA is a bond alignment system that delivers high precision, flexibility, and ease of use, making it ideal for a wide range of production environments. IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®6200∞ BA for customers across the UK.

What is the EVG®6200∞ BA used for?

With exceptional accuracy, the system supports the most demanding alignment processes in MEMS production, as well as emerging fields like 3D integration applications.

What makes the EVG®6200∞ BA suited to production environments?

It combines high precision, flexibility, and ease of use, which is what makes it applicable across a wide range of production environments rather than a single niche use case.

Where can I buy or get support for the EVG®6200∞ BA in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®6200∞ BA and the wider EVG bond alignment portfolio.

• Suitable for all EVG 200 mm bond systems
• Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
• Manual or motorized alignment stage with automatic alignment option
• Fully motorized high-resolution bottom-side microscopes
• Windows® based user interface
• Options
• Automatic alignment IR alignment for inner substrate key alignment
• NanoAlign® package for enhanced process capabilities
• Available with system rack
• Upgrade possibility to mask aligner

Applications:

• MEMS / Sensor Device Fabrication
  Precise alignment of device wafers to capping or carrier wafers prior to bonding (e.g., for sealing, encapsulation, cavity formation).
  
  
• 3D Integration / Stacked Wafers
  Aligning multiple layers before bonding in 3D-IC or heterogeneous integration stacks.
  
  
• Pilot / Low-Volume Production
  In production settings where throughput matters, but full production systems may not be justified, 6200∞ BA is more automation-capable than earlier aligners yet more affordable than full-scale tools.
  
  
• Bond Process Development & Optimization
  For refining alignment tolerances, overlay budgets, and bonding yield in development labs before scaling to full production.
  
  
• Technology Transfer / Scale-Up
  Because this aligner is designed for production environments, processes developed using it can scale more directly to manufacturing bonders.