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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Equipment Partners

Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Insights

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EV Group Enquire Now

EVG®501

The EVG®501 is a highly flexible wafer bonding system, supporting all common bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. Its easy-access bond chamber and user-friendly tooling design enable quick retooling for different wafer sizes and processes, making it ideal for universities, R&D facilities, and low-volume production. The bond chamber design mirrors that of EVG’s high-volume manufacturing tools, such as the EVG® GEMINI, ensuring seamless scalability. Bonding recipes are easily transferable, enabling smooth transition to larger production volumes as needs grow.

Features:

  • Unique pressure and temperature uniformity
  • Compatible with EVG mechanical and optical aligners
  • Flexible design and configurations for research
  • From single chips to wafers
  • Various processes (eutectic, solder, TLP, direct bonding)
  • Optional turbopump (<1E-5mbar)
  • Upgradeable for anodic bonding
  • Open chamber design for easy conversion and maintenance
  • Pilot production compatible
  • Open chamber design for easy conversion and maintenance
  • Smallest footprint for a 200 mm bonding system: 0.8 m2
  • Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Technical Data:

  • Max contact force
    20 KN
  • Heater Size 
    150 mm - single chips 
    200 mm - 100 mm
  • Vacuum 
    Standard: 0.1 mbar
    Optional: 1E-5 mbar
  • Max temperature: 
    450 °C
  • Single chips processing
    Yes
  • Bond chuck system / Alignment system
    150 mm heater: EVG®610, EVG®620, EVG®6200
    200 mm heater: EVG®6200, SmartView® NT
  • Active Water cooling 
    For bottom side
  • Power supply for anodic bonding
    Max. voltage: 2 kV
    Max. current: 50 mA
  • Loading chamber
    Manual

Applications:

  • MEMS and Sensors: Fabrication of micro-electromechanical systems and sensors.

  • Optical Devices: Production of waveguides and other optical components.

  • 3D Integration: Stacking of chips for 3D integration.

  • Advanced Packaging: Packaging of semiconductor devices.

  • Research and Development: Development of new bonding processes and materials.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.

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