EVG®301
The EVG®301 is a versatile semi-automated single wafer cleaning system, featuring a single cleaning bowl and manual loading with pre-alignment. Designed for flexible cleaning procedures, the EVG®301 is an ideal R&D tool for various cleaning needs. It can be seamlessly integrated with EVG’s wafer alignment and bonding systems to remove particles prior to wafer bonding, or combined with EVG’s debonding systems to eliminate temporary bonding adhesive after debonding.
Features:
- High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
- Brush scrubbing for single-side cleaning (option)
- Diluted chemicals for wafer cleaning
- Prevents cross-contamination from back to front side Fully software controlled cleaning process
- Options:
- Pre-bonding station with IR-inspection
- Tooling for non-SEMI standard substrates
Applications:
- Pre-Bonding Cleaning: The EVG®301 is utilized to eliminate particles and contaminants from wafer surfaces prior to bonding processes, such as fusion bonding or hybrid bonding.
- Post-Debonding Cleaning: After temporary bonding and subsequent debonding, the system effectively removes residual bonding adhesives, preparing the wafers for further processing or reuse.
- Advanced Packaging and 3D Integration: In the development of advanced packaging solutions and 3D integrated circuits, maintaining clean wafer surfaces is crucial. The EVG®301 ensures high cleanliness standards, facilitating successful bonding and integration.
- MEMS and Semiconductor Device Fabrication: For microelectromechanical systems (MEMS) and semiconductor devices, the EVG®301 provides the necessary cleaning capabilities to support precise and reliable device fabrication.