EVG®520 IS
The EVG®520 IS is optimised for small-volume production applications, built on customer feedback and EV Group’s continuous technological innovations. It features EVG’s proprietary symmetric rapid heating and cooling chuck design, delivering superior temperature and force uniformity for precise bonding. With high-force bonding capability and the same material and process flexibility as manual systems, the EVG®520 IS ensures the success of all wafer bonding processes, making it a reliable solution for diverse production needs.
Features
- Fully automated processing with manual loading and unloading including external cooling station
- Compatible with EVG mechanical and optical aligners
- Single- or double-chamber automated system
- Fully automated bond process execution and bond cover movements
- Integrated cooling station for high throughput
- Options: High vacuum capability (1E-6 mbar) Programmable mass flow controller
- Integrated cooling
Applications:
- MEMS / Microdevices
Bonding microelectromechanical devices (e.g. capping, wafer stacking, chamber sealing) often requires precise temperature control, force, and vacuum. - 3D Integration / Heterogeneous Integration
Bonding dissimilar materials or stacking wafers (e.g. logic + sensor layers) with controlled thermal gradients and high-pressure bonding helps ensure good interface quality. - Optoelectronics / Photonics
Bonding optical wafers (e.g. glass, silicon, transparent substrates) for waveguides, photonic circuits, or substrate bonding in photonic device stacks. - Wafer-Level Packaging
In packaging processes where wafers are bonded before dicing — e.g. sealing, capping, interposer stacking — the EVG 520 IS provides automation and high throughput.