EVG®320

The EVG®320 is an automated single wafer cleaning system that handles wafers and substrates automatically between process stations. Equipped with a robotic handling system, it ensures precise pre-alignment and loading of wafers, supporting both cassette-to-cassette and FOUP-to-FOUP operations.

Features:

• Up to four cleaning stations
• Fully automated cassette-to-cassette or FOUP-to-FOUP handling
• Edge handling for double-sided cleaning processes available (option)
• High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
• Advanced remote diagnostics
• Prevents cross-contamination from back to front side
• Fully software controlled cleaning process

Technical Data:

Wafer diameter (substrate size) - 200, 100 - 300 mm

Cleaning system 

1. Open chamber, spinner and cleaning arm
2. Chamber: made of PP or PFA (option)
3. Cleaning media: DI-water (standard), other cleaning media (option)
4. Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials
5. Rotation: up to 3000 rpm (in 5 sec)

Megasonic nozzle 

1. Frequency: 1 MHz (3 MHz option)
2. Output power: 30 - 60 W
3. DI-water flow rate: up to 1.5 liter/min
4. Effective cleaning area: Ø 4.0 mm
5. Material: PTFE

Applications:

• Pre-Bonding Cleaning: Essential for preparing wafers before bonding processes such as fusion or hybrid bonding, ensuring surfaces are free from contaminants.
  
  
• Post-Debonding Cleaning: Used to remove residual bonding materials after debonding processes, preparing wafers for reuse or further processing.
  
  
• Advanced Packaging and 3D Integration: Supports applications requiring high cleanliness standards, such as 3D system-on-chip (SoC) devices and advanced packaging solutions.
  
  
• MEMS and Semiconductor Device Fabrication: Plays a crucial role in the fabrication of microelectromechanical systems (MEMS) and semiconductor devices, where surface cleanliness is critical for device performance and reliability.