EVG®610 BA

Renowned for its automation and reliability, the EVG®620 bond alignment system combines high precision, flexibility, and ease of use across various production environments. Its exceptional precision makes it ideal for the most demanding alignment processes in MEMS production and emerging applications, such as 3D integration.

Features:

• Most suitable for EVG®501 and EVG®510 bonding systems
• Wafer and substrate sizes up to 150 / 200 mm
• Manual high-precision alignment stage
• Manual-operated bottom-side microscope
• Windows® based user interface
• Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages)
• Desktop system design with minimum footprint
• Supports IR alignment process
• Optimum total cost of ownership (TCO) for R&D and pilot line production

Applications:

• MEMS and microdevices bonding 
  Aligning sensor wafer to cap wafer, capping membranes, aligning features across wafers before bonding.
  
  
• 3D integration / heterogeneous stacking 
  Aligning layers prior to stacking for 3D structures, ensuring correct registration across layers.
  
  
• Pilot / R&D bonding flows
  In research labs or development fabs where automated bond aligners may be overkill or too expensive, the 610 BA serves as a lower-cost alignment option.
  
  
• Bond process development
  tuning bonding stack alignment margins, studying alignment-dependent defect behavior, or validating alignment strategies before scaling to automated tools.
  
  
• Small-volume production 
  for niche devices or low-volume runs, where the speed of alignment is not the bottleneck, but precision is critical.