EVG®510

The EVG®510 is a highly flexible wafer bonding system, supporting a wide range of processes including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. Its easy-access bond chamber and intuitive tooling design facilitate quick retooling for different wafer sizes and processes, making it an excellent choice for universities, R&D facilities, and low-volume production applications. The bond chamber design closely mirrors that of EVG’s high-volume manufacturing tools, such as the EVG® GEMINI, ensuring compatibility and enabling easy transfer of bonding recipes. This makes the EVG®510 an ideal platform for scaling up production volumes as needs evolve.

Features

• Unique pressure and temperature uniformity
• Compatible with EVG mechanical and optical aligners
• Flexible design and configurations for research and piloting
• Form single chips to wafers
• Various processes (eutectic, solder, TLP, direct bonding)
• Optional turbopump (<1E-5 mbar)
• Upgradeable for anodic bonding
• Open chamber design for easy conversion and maintenance
• Production compatible
• High throughput with fast heating and pumping specifications
• High yield through automatic wedge compensation
• Open chamber design for fast conversion and maintenance
• Smallest footprint for a 200 mm bonding system: 0.8 m2
• Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Applications:

• MEMS & Sensors        
  For fabricating MEMS devices, sealing cavities, stacking membranes, packaging sensors, etc. Bonding processes like glass frit, eutectic, or direct bonding may be used.

• 3D Integration & Heterogeneous Integration        
  Bonding different types of wafers or substrates (e.g. silicon to glass, silicon to silicon, integrating sensor/logic layers) in multi-layer stacks.

• Optoelectronics / Photonics        
  Bonded structures for photonic devices, waveguides, optical elements; bonding active or passive layers onto substrates.

• Academic / R&D / Pilot Lines        
  Because of its flexibility and ability to transfer recipes to higher-end tools, R&D labs and pilot fabs often use 510 to develop and validate bonding processes.

• Wafer-Level Packaging / Advanced Packaging        
  Bonding wafers or dies during packaging steps (e.g. sealing, bonding cap wafers, bonding to interposers).

• Process Development / Bonding Process Exploration        
  Exploring new bonding materials/processes (e.g. TLP, direct, hybrid bonding) in a platform that allows switching and rapid iteration.

• Small-Volume / Low-Volume Production        
  For niche devices or small-run production, where full-scale automated tools may not be cost-effective, the EVG 510 offers adequate throughput with process reliability.