SmartView NT

The SmartView NT is an automated bond alignment system offering a proprietary method for micron-level face-to-face wafer alignment. This advanced alignment technique is crucial for achieving the high precision needed in multiple wafer stacks for cutting-edge technologies. Ideal for applications like wafer stacking for 3D interconnects, wafer-level packaging, and high-volume MEMS devices, the SmartView NT ensures accuracy and efficiency in demanding production environments.

Features:

• Suitable for automated and integrated EVG bonding systems (EVG560®, GEMINI®) in 200 mm and 300 mm configurations
• Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices
• Universal bond aligner (face-to-face-, backside-, infrared- and transparent alignment)
• No Z-axis motion and no refocusing required
• Windows® based user interface
• Bond pairs are aligned and clamped prior to loading into the bond chamber
• Manual or fully automated configurations (e.g. integration with GEMINI®)
• Options
• Can be combined with the EVG®500 series wafer bonding systems, EVG®300 series cleaning systems and EVG®810 LT plasma systems for a fully automated wafer-to-wafer alignment operation with cassette-to-cassette operation

Applications:

• 3D Integrated Circuits (3D-ICs)
  The SmartView NT is instrumental in stacking wafers for 3D interconnects, enabling the vertical integration of multiple semiconductor layers to enhance device performance and reduce footprint.
  
  
• Wafer-Level Packaging (WLP)
  It supports wafer-level packaging processes, where chips are packaged at the wafer stage, improving performance and reducing costs by eliminating the need for traditional packaging steps.
  
  
• High-Volume MEMS Devices
  The system is well-suited for high-throughput manufacturing of MEMS devices, which are used in various applications such as sensors, actuators, and microfluidic systems.
  
  
• Advanced Bonding Techniques
  The SmartView NT facilitates various bonding methods, including eutectic bonding, anodic bonding, and transient liquid phase (TLP) bonding, which are essential for creating robust and reliable interconnections in microelectronics.
  
  
• Integration with EVG Bonding Systems
  It can be integrated with EVG's bonding systems like the EVG®560 and GEMINI® series, providing a comprehensive solution for wafer-to-wafer alignment and bonding processes.