Q240S
The Q 240S is a compact and streamlined variant of the flagship Q-series plasma systems. It retains the same generous chamber diameter, while featuring a reduced depth—making it an excellent choice for labs and production lines where space efficiency is critical.
Key Features:
Optimized Footprint
- Shares the larger Q-series chamber diameter but with a shallower design, delivering high processing capability in a smaller overall unit.
Space-Savvy Dimensions & Weight
- Dimensions (L × W × H): 620 × 550 × 500 mm
- Weight: 75 kg, significantly lighter than its full-depth counterpart.
Technical Data:
- Dimensions: L: 620mm W: 550mm H: 500mm
- Weight: 75 KG
- Volume: 9 Liter
- Process chamber: Quarzglas, 240mm Ø , B: 244mm
- Microwave output: 2,45 GHz / 50 - 1200 Watt
- Inclusive: 1 gas channel (gas distribution system inside the process chamber), up to 3 channels available
- Substrate holder (optional): aluminium, custom design possible
- Vacuum connection: DN 40 ISO-KF
- Venting: electromagnetic solenoid valve
- Pump system: up to 25m³/h
- Chamber door: you can choose between hinged-type with viewing port and drawer door with attached support rods
- Wafer size: up to 150mm, at a number of 25 wafers
Applications:
- Semiconductor manufacturing and wafer packaging: For wafers up to ~200 mm diameter, for resist removal, MEMS, sensors.
- Micro-electronics / MEMS devices: Small devices, devices built on wafer format, requiring clean environment and minimal footprint machines.
- Advanced sensor / photonics industries: Where circular substrates or wafer formats are common, and clean plasma treatment is needed.
- R&D / pilot production: Facilities where space is limited and full-sized large chambers may not be justified but high-quality plasma treatment is still required.
- Clean-room environments in automotive, medical, aerospace electronics: When high cleanliness and reliable surface prep are required, though on smaller substrates rather than large modules.