AL900

The AL 900 Control Active is an advanced, high-throughput desmearing plasma system engineered for efficient and uniform cleaning of large circuit board panels. Built for demanding industrial and R&D settings, it delivers powerful, customisable plasma desmearing through a robust, precision-controlled platform.

Key Features:

Large Processing Volume

• A capacious 900 L treatment chamber enables high-volume throughput for large-format substrates or multiple panels simultaneously. 

Industrial-Scale Dimensions

• Footprint: 1,800 mm L × 1,500 mm W × 1,700 mm H
• Weight: 620 kg 

Multi-Panel Capability

• Designed to process up to 18 circuit boards measuring 18 × 24″ or 20 × 24″ at once, significantly boosting productivity. 

Dual Power Sources for Versatile Plasma Generation

• Low-Frequency (LF): 40 kHz, up to 10 kW—ideal for high-density ion generation.
• Microwave: 2.45 GHz, adjustable output from 50 to 1,200 W—for fine-tuned plasma control. 

Integrated Gas Distribution System

• Comes standard with 3 gas channels, with options to expand up to 7 channels, enhancing flexibility for different process gases and recipes. 

Modular Substrate Handling

• Optional custom-designed aluminum substrate holders allow greater flexibility and adaptability for diverse panel sizes or shapes. 

Robust Vacuum & Venting Infrastructure

• Vacuum interface: DN 250 ISO-KF connection
• Venting: via electromagnetic solenoid valve—ensuring precise pressure control and rapid cycle times. 

User-Friendly Design

• The hinged chamber door includes a viewing port for safe, convenient loading/unloading and visual process monitoring.

Technical Data:

• Dimensions: L: 1800mm W: 1500mm H: 1700mm
• Weight: 620 KG
• Volume: 900 Liter
• Porcess chamber: aluminum with electron cage:
• circuit boards: up to 18 panels mit 18x24" or 20x24"
• LF-output (Low Frequency): operating frequency = 40 KHz, up to 10 kW
• Microwave output: 2,45 GHz / 50 - 1200 Watt
• Inclusive: 3 gas channel (gas distribution system inside the process chamber), up to 7 channels available
• Substrate holder (optional): aluminium, custom design possible
• Vacuum connection: DN 250 ISO-KF
• Venting: electromagnetic solenoid valve
• Pump system: up to 600m³/h
• Chamber door: hinged-type with viewing port

Applications:

• Electronics manufacturing / PCB fabrication: For companies manufacturing multilayer PCBs, HDI boards, complex interconnect substrates.
  
  
• Automotive electronics: Many automotive modules require high reliability; desmearing helps ensure durability under vibration/temperature.
  
  
• Aerospace & defence electronics: Where reliability and traceability are critical, and board failures are very costly.
  
  
• Consumer electronics (higher end): For premium devices where board reliability is important (though perhaps smaller scale than automotive).
  
  
• Medical electronics / implantable modules: Similar reason: high reliability, clean board finish, no delamination – desmearing helps.
  
  
• Other substrates with drilled holes requiring cleaning: Not just PCBs – potentially other laminated assemblies with drilled vias or holes needing clean surfaces for bonding/ plating.