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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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Q150

The Q 150 is a compact, high-performance plasma system designed for semiconductor and microelectronics applications. Featuring a quartz glass process chamber and microwave plasma generation, it delivers precise, low-damage surface treatment for substrates up to 125 mm in diameter. Ideal for cleanroom environments, it offers both tabletop and wall-mounted installation options to suit diverse laboratory setups.

Key Features:

  • Process Chamber: Quartz glass, 150 mm diameter, 260 mm depth, providing a 6-liter volume for efficient plasma processing.
  • Microwave Power: Operates at 2.45 GHz with adjustable power output ranging from 50 to 1,200 W, enabling flexible control over plasma density and energy.7
  • Vacuum System: Equipped with a Pirani gauge (1–1,000 Pa), DN 25 ISO-K vacuum connection, and an electro-pneumatic valve for precise pressure control.
  • Utilities: Requires a 3-phase AC 50/60 Hz 400/240 V 16 A power supply.
  • Dimensions: 500 mm (W) × 370 mm (D) × 550 mm (H); weighs 40 kg (excluding pump).
  • Installation Options: Suitable for cleanroom wall installation or as a tabletop unit, offering flexibility to fit various laboratory configurations.

Applications

  • Semiconductor manufacturing (lithography, resist stripping, cleaning steps)

  • MEMS / microelectromechanical systems fabrication

  • Chip packaging and advanced packaging (wire-bond, flip-chip, underfill, RDL)

  • Photonics and optoelectronic device manufacture (where surfaces need cleaning/activation)

  • R&D / pilot production labs with smaller wafers or non-standard substrates

 

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.