IES partners with six equipment manufacturers serving the semiconductor, photonics, MEMS, and compound materials industries: Veeco (Massachusetts, USA), EV Group (Austria), scia Systems (Germany), Alpha Plasma (Germany), Surface Science Integration (Arizona, USA), and Plasma Parylene Systems (Germany). Each covers a different core technology, from lithography and wafer bonding to plasma processing and thin film deposition. 

Yes. IES partners with Veeco, based in Massachusetts, USA, to supply atomic layer deposition tools to the UK and European microelectronics market. 

IES partners with EV Group (EVG), based in St. Florian am Inn, Austria, covering photolithography, nano-imprinting, and wafer bonding systems. 

IES works with two specialist plasma partners: Alpha Plasma (Bad Aibling, Germany), which covers microwave etching for resist ashing, descum, surface activation, and device packaging; and Plasma Parylene Systems (Rosenheim, Germany), which covers wider plasma technology applications. 

IES partners with scia Systems, based in Chemnitz, Germany, which specialises in advanced ion beam trimming, lens figuring, and milling solutions. 

Yes, through IES's partnership with Surface Science Integration, based in Arizona, USA, which specialises in rapid thermal processing systems. 

Yes. IES can arrange live or online demonstrations at its partners' application labs across Europe and the US, covering EVG, scia Systems, Veeco, PPS, and SSI, tailored to a specific process or a full solution evaluation. 

IES provides local UK and European engineering support, application knowledge, and long-term service backing alongside the equipment itself, rather than just a sales transaction — relevant given IES has supported semiconductor fabs and OEMs since 1991.