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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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AL18 M

The Alpha Plasma System AL 18 is a compact, high-performance plasma processing solution that brings flexibility, precision, and robust engineering to semiconductor packaging and R&D environments. Its modular design, advanced microwave plasma capabilities, and optional enhancements offer customers a tailored toolset to streamline production and achieve uniform results across multiple packaging tasks.

Key Features:

  • Cutting-Edge Plasma Technology: Incorporates Alpha Plasma’s proprietary design with microwave coupling, enabling multiple operational modes—including the proven Electron Cyclotron Resonance (ECR)—for exceptional process flexibility.
  • Rotary Table Option: Supports classic rotary table configurations for enhanced sample throughput and ease of loading

Technical Data:

  • Process chamber: Aluminum
  • Volume: 18 liters
  • Chamber size: W 250 mm × D 290 mm × H 250 mm
  • Chamber door: Hinged – type with viewing port
  • Microwave power: 2.45 GHz, adjustable between 50 and 600 Watts

  • Options:

    • Vacuum pump
    • Gas Channel
    • Rotary table
    • ECR set-up

  • Utilities: 3/N/PE AC 50 Hz 400/240 V 16 A
  • Dimensions: W 530 mm × D 600 mm × H 550 mm
  • Weight: 40 kg w/o pump ; approx . 100 kg w/ vacuum pump

Applications:

  • Semiconductors & Microelectronics  Wafer cleaning, resist removal, surface activation before bonding or metallisation.

  • MEMS & Sensors Preparation of surfaces before bonding, cleaning delicate microstructures, improving adhesion of sacrificial and functional layers.

  • Advanced Packaging Surface activation prior to wire bonding, flip-chip attach, and encapsulation.

  • Photonics & Optoelectronics Cleaning and activation of optical substrates prior to coating or assembly.

  • Medical & Biomedical Devices Surface modification and activation for polymer bonding, biocompatible coatings, and implantable device preparation.

  • Research & Development Material surface studies, functionalisation, plasma cleaning, and prototype fabrication.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.