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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®770

The EVG770 is designed for step-and-repeat nanoimprint lithography, being utilised for direct patterning of complex structures on substrates, as well as efficient master fabrication. Uniform replication of templates is enabled – from small dies up to 50 mm x 50 mm across large areas up to 300 mm substrate sizes. Step-and-repeat imprinting is typically used in combination with direct writing methods and diamond turning to produce masters which are needed in wafer-level optics manufacturing or the EVG SmartNIL process. Among the EVG770’s key features are; full process control, exact alignment capabilities, and the adaptability to meet requirements for a broad range of devices and applications.

Features:

  • Efficient master fabrication of microlenses for wafer-level optics down to nanostructures for SmartNIL®
  • Simple implementation of different kind of masters
  • Variable resist dispense modes
  • Live image during dispensing, imprinting and demolding In-situ force control for imprint and demolding
  • Optional optical wedge error compensation
  • Optional automated cassette-to-cassette handling

Applications:

  • Wafer-Level Optics (WLO): Fabrication of microlenses and other optical components for advanced imaging systems.
  • Augmented Reality (AR) Waveguides: Production of waveguides for AR devices, enabling advanced display technologies.
  • Diffractive Optics: Manufacturing of diffractive optical elements for various photonic applications.
  • Metasurfaces: Creation of nanostructured surfaces with tailored optical properties.
  • Biomedical Devices: Development of microfluidic devices and lab-on-a-chip systems for medical diagnostics and research.

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