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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®770

The EVG770 is designed for step-and-repeat nanoimprint lithography, being utilised for direct patterning of complex structures on substrates, as well as efficient master fabrication. Uniform replication of templates is enabled – from small dies up to 50 mm x 50 mm across large areas up to 300 mm substrate sizes. Step-and-repeat imprinting is typically used in combination with direct writing methods and diamond turning to produce masters which are needed in wafer-level optics manufacturing or the EVG SmartNIL process. Among the EVG770’s key features are; full process control, exact alignment capabilities, and the adaptability to meet requirements for a broad range of devices and applications.

Features:

  • Efficient master fabrication of microlenses for wafer-level optics down to nanostructures for SmartNIL®
  • Simple implementation of different kind of masters
  • Variable resist dispense modes
  • Live image during dispensing, imprinting and demolding In-situ force control for imprint and demolding
  • Optional optical wedge error compensation
  • Optional automated cassette-to-cassette handling

Applications:

  • Wafer-Level Optics (WLO): Fabrication of microlenses and other optical components for advanced imaging systems.
  • Augmented Reality (AR) Waveguides: Production of waveguides for AR devices, enabling advanced display technologies.
  • Diffractive Optics: Manufacturing of diffractive optical elements for various photonic applications.
  • Metasurfaces: Creation of nanostructured surfaces with tailored optical properties.
  • Biomedical Devices: Development of microfluidic devices and lab-on-a-chip systems for medical diagnostics and research.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.