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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®7200

The EVG®7200 system utilises EVG’s advanced SmartNIL™ technology, enabling the fabrication of micro- and nanostructures with exceptional pattern fidelity and low residual layer. Exposure is driven by tunable LED lamps, allowing for the rapid solidification of a wide range of UV-curable materials, thereby improving throughput. The system ensures high yield through controlled and smooth demolding, with integrated force measurement for precision. Ideal for large-area nanostructure printing, the EVG®7200 delivers unmatched throughput, low cost of ownership, and is perfectly suited for the volume production of next-generation microfluidic and photonic devices, such as diffractive optical elements (DOEs). With its combination of high performance and cost efficiency, the EVG®7200 with SmartNIL™ technology is the optimal solution for advanced nanotechnology applications. (*Resolution is dependent on process and template.)

Features:

  • Volume-proven imprinting technology with superior replication fidelity
  • Proprietary SmartNIL® technology with multiple-use polymer stamp technology
  • Integrated imprinting, UV curing, demolding, and working stamp fabrication
  • Automated cassette-to-cassette handling plus semi-automated R&D mode
  • Optional top-side alignment
  • Optional mini-environment
  • Open platform for all commercially available imprint materials
  • Scalability from R&D to production
  • System housing for best process stability and reliability

Applications:

  • Display Technologies
    Fabrication of wire grid polarizers and other optical components for displays.

  • Photonic Devices
    Production of diffractive optical elements (DOEs) and other photonic structures.

  • Biotechnology
    Development of microfluidic devices and lab-on-a-chip systems.

  • Optical Components
    Manufacturing of micro-optical lenses and gratings.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.