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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®720

The EVG®720 system incorporates EVG’s cutting-edge SmartNIL™ technology, enabling the manufacturing of micro- and nanostructures with exceptional pattern fidelity and minimal residual layer. Exposure is achieved using tunable intensity LED lamps, providing fast solidification of a wide range of UV-curable materials and significantly improving throughput. With controlled and smooth demolding, supported by force measurement, the EVG®720 ensures high yield and precision in every process. This system is capable of printing large-area nanostructures with unmatched throughput, making it an ideal solution for high-volume production of next-generation microfluidic and photonic devices, including diffractive optical elements (DOEs). Designed for low cost of ownership and high efficiency, the EVG®720 with SmartNIL™ technology is the optimal choice for the future of nanotechnology production. (*Resolution is dependent on process and template. 

Features:

  • Volume-proven imprinting technology with superior replication fidelity
  • Proprietary SmartNIL® technology with multiple-use polymer stamp technology
  • Integrated imprinting, UV curing demolding, and working stamp fabrication
  • Automated cassette-to-cassette handling plus semi-automated R&D mode
  • Optional top-side alignment
  • Optional mini-environment
  • Open platform for all commercially available imprint materials
  • Scalability from R&D to production
  • System housing for best process stability and reliability

Applications:

  • Diffractive Optical Elements (DOEs) / Optics / Photonics        
    Manufacturing periodic or quasi‑periodic nanoscale structures for wavefront shaping, gratings, beam splitting, diffractive lenses, optical filters. The full-field imprint and high fidelity make it appropriate.

  • Microfluidics / Lab-on-a-Chip        
    Imprinting micro- and nanoscale channels, features, surface textures in polymer layers; useful due to its ability to pattern large areas and conform to non-ideal surfaces.

  • Meta-surfaces / Metastructures / Nanophotonics        
    Creating arrays of sub‑wavelength features for manipulating light (e.g. metasurfaces for lenses, beam steering, color, polarization).

  • Bio‑/Medical Devices        
    Patterning of nano-/micro‑structured surfaces for cell interaction, bio-sensing surfaces, micro‑arrays, etc.

  • Micro- & Nano-Optics for AR/VR / Waveguides        
    Imprinting optical waveguides or surface diffractive structures used in displays, augmented reality devices, micro‑optical elements.

  • Prototype / Pilot Production of Nanopatterned Surfaces        
    Because the EVG 720 supports automation and throughput, it is useful not only for R&D but also small volume manufacturing of devices requiring nano-scale patterning.

  • High Throughput Nanopatterning        
    The integration of imprinting + curing + demolding enables continuous or semi-continuous workflows, reducing handling steps and increasing throughput.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.