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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

Services

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Equipment Partners

Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Insights

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EV Group Enquire Now

EVG®510 HE

The EVG510 HE is ideal for the high precision imprinting thermoplastic substrates. It is a semi-automated hot embossing system which is configured with vacuum and contact force functions, as well as a universal embossing chamber. The EVG510 HE manages the complete selection of polymers which are suited to hot embossing. The system offers a variety processes for high-quality nanopattern transfer, along with multiple de-embossing and high-aspect-ratio embossing options.

Features:

  • For hot embossing applications of polymer substrates and spin-on polymers
  • Automated embossing process EVG's proprietary separate alignment process for optically aligned embossing and imprinting
  • Fully software controlled process execution
  • Closed-loop cooling water supply option
  • External de-embossing and cooling station

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.

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