EVG®50
The EVG®50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated into EVG’s high-volume manufacturing systems) provide highly accurate, high-speed measurements using a variety of measurement methods for a wide range of applications. The system is designed for multi-layer thickness measurements, including determination of the total thickness variation (TTV) of intermediate layers, bond interface inspection, and resist thickness measurement. Engineered to meet the stringent demands of the yield-driven semiconductor industry, the EVG®50 and Inline Metrology Module ensure precision and efficiency in production environments.
Features:
- Multi-layer metrology with industry-leading throughput and resolution
- Multi-layer-thickness mapping
- Bond interface inspection
- Low contact edge handling
- Particle free
- Full-area accessible front- and backside
- Self-calibrating for better system reproducibility and more productive time
- Various output formats 100% production inspection
Applications:
- Multi-Layer Thickness Measurement
The EVG®50 excels in determining the total thickness variation (TTV) of intermediate layers within bonded wafer stacks, providing critical data for process optimization. - Bond Interface Inspection
It offers detailed inspection of bond interfaces, detecting potential defects and ensuring the integrity of the bonding process. - Resist Thickness Measurement
The system accurately measures resist thickness, essential for lithography processes and maintaining device performance. - Wafer Bow and Warpage Analysis
It assesses wafer bow and warpage, which are crucial for evaluating stress and ensuring the mechanical stability of wafers during processing.