EVG®40 NT

The EVG®40 NT (stand-alone tool) and AVM (HVM-integrated module) are designed to measure key lithography parameters, such as critical dimensions and bond alignment accuracy. With its high measurement precision, the system ensures compliance with stringent process specifications and enables real-time optimisation of integrated process parameters. Thanks to its versatile measurement capabilities, the EVG®40 NT adapts to a wide range of manufacturing processes, including nanoimprint lithography and wafer-to-wafer bonding. For example, the EVG®40 NT serves as the essential tool for verifying the 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system, completing the product range for highly accurate aligned wafer bonding.

Features:

• Versatile measurement options for lithography and bonding metrology
• Alignment verification for bonding and lithography applications
• Top- to bottom-side microscope for manifold measurement methods
• Critical dimension (CD) measurement
• Die-to-die alignment verification
• Multi-layer thickness measurement
• High measurement accuracy in vertical and lateral direction
• High throughput due to specialized calibration routine
• PC-based measurement and pattern recognition software for highest reliability

Applications:

• Bond Alignment Verification
  The EVG®40 NT is utilized for verifying alignment accuracy in various bonding processes, including wafer-to-wafer (W2W) and die-to-die (D2D) bonding, ensuring precise alignment for high-quality device fabrication.
  
  
• Critical Dimension (CD) Measurement
  It enables accurate measurement of critical dimensions in lithography processes, essential for maintaining the integrity of nanoscale features in semiconductor devices.
  
  
• Multi-Layer Thickness Measurement
  The system provides capabilities for measuring the thickness of multiple layers, aiding in the assessment of layer uniformity and quality in multi-layer semiconductor
  structures.
  
  
• Die-to-Die Alignment Verification
  The EVG®40 NT supports die-to-die alignment verification, crucial for ensuring the precise placement of dies in advanced packaging applications.