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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

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The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Equipment Partners

Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Insights

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EV Group Enquire Now

IQ ALIGNER NT

The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

Features

  • Zero assist bridge tool - dual substrate concept supporting flexibility of production for 200 mm and 300 mm
  • Throughput > 200 wph (first print)
  • Cutting-edge alignment accuracy
  • Top-side alignment down to 250 nm
  • Back-side alignment down to 500 nm
  • Broadband intensity > 120 mW/cm² (300 mm wafer)
  • Full Clearfield Mask Movement (FCMM) for flexible pattern positioning and compatibility for darkfield mask alignment
  • Contact-free in-situ mask-to-wafer proximity gap verification
  • Excellent run-out compensation thanks to ultra-flat and fast response temperature-controlled wafer chuck
  • Manual substrate loading capability
  • Rework sorting wafer management and flexible cassette system
  • Remote tech support and GEM300 compatibility
  • Smart process control and data analysis feature [Framework Software Platform]
  • Integrated analysis features for process and machine control
  • Equipment and process performance tracking feature
  • Parallel/queueing task processing feature
  • Smart handling features
  • Occurrence and alarm analysis
  • Smart maintenance management and tracking

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.

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