EVG®610
What is the EVG®610?
The EVG®610 is a semi-automatic mask and bond aligner built for R&D and university labs, handling substrates from small pieces up to 200 mm (8") wafers. It combines mask alignment, bond alignment, IR alignment, and UV nanoimprint lithography (NIL) in a single compact system, making it a flexible entry point into EV Group's mask and bond alignment platform without the cost of full production automation.
IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®610 for customers across the UK.
What alignment and exposure modes does it support?
The EVG®610 supports vacuum, hard, soft, and proximity contact exposure modes, with optional backside (bottom-side) alignment for double-sided lithography. A high-precision alignment stage and automated wedge compensation sequence keep results repeatable across runs, while a motorised, recipe-controlled exposure gap adds process flexibility. The system also supports the latest UV-LED technology.
What else can it do beyond mask alignment?
Beyond standard mask alignment, the EVG®610 offers bond alignment for wafer-to-wafer and die-to-wafer processes, IR alignment, and UV nanoimprint lithography (UV-NIL) — useful for MEMS, sensors, compound semiconductors, and advanced packaging work.
Why is it suited to academic and research environments?
Its minimised footprint reduces facility requirements, and a multi-user interface (unlimited user accounts and recipes, assignable access rights, multiple UI languages) plus remote diagnostics support makes it easy to manage across shared, multi-operator lab settings — from first-time student users to experienced process engineers.
Where can I buy or get support for the EVG®610 in the UK?
As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®610 and the wider EVG mask, bond, and NIL alignment portfolio.
- Wafer/substrate size from pieces up to 200 mm/8’’
- Top-side and bottom-side alignment capability
- High-precision alignment stage
- Automated wedge compensation sequence
- Motorized and recipe-controlled exposure gap
- Supports the latest UV-LED technology
- Minimized system footprint and facility requirements
- Step-by-step process guidance
- Remote tech support
- Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
- Agile processing and conversion re-tooling
- Table top or stand-alone version with anti-vibration granite table
- Additional capabilities:
- Bond alignment
- IR alignment
- Nanoimprint lithography (NIL)
Applications:
- Photolithography / Mask Aligner for Resist Patterning
The EVG 610 is used to pattern photoresist on substrates via mask exposure (UV) with alignment (top or bottom). This is a standard first step in micro/nanofabrication to define features. - Double-Sided / Back-Side Lithography
Because it supports bottom-side (back-side) alignment, the EVG 610 can align and expose features on the reverse side of a wafer or substrate, enabling double-sided device structures. - Wafer / Substrate Bond Alignment
It can perform alignment for bonding operations (e.g. wafer-to-wafer, die-to-wafer), helping align two substrates precisely before bonding. - Nanoimprint Lithography (NIL / UV-NIL)
The system supports UV-based nanoimprint lithography: stamping a nano-scale pattern from a mold (stamp) onto a resist using imprint + UV curing, leveraging its alignment and exposure capabilities. - Prototyping / Research / Academia
Because of its flexibility, re-tooling speed, and support for multiple modes, it’s often used in university clean rooms, research labs, and pilot-line environments to develop new process flows or test new materials. - Advanced Packaging / MEMS / Sensors / Compound Semiconductors
The mask aligner family (including the EVG610) is used in domains such as MEMS, sensors, power devices, compound semiconductors, advanced packaging, etc., to pattern features, align layers, and integrate components. - Migration to Volume Production Processes
Because EVG designs the 610 to be compatible with its production-level alignment / bonding tools, processes developed on it can be more readily transferred to manufacturing tools.