EVG®610

The EVG®610 is a versatile R&D system designed for both mask and bond alignment, accommodating substrates from small pieces up to 200 mm wafers. It supports various lithography processes—including vacuum, hard, soft, and proximity exposure modes—with optional backside alignment. Additionally, the system offers capabilities such as bond alignment, infrared (IR) alignment, and UV Nanoimprint Lithography (NIL). Featuring a high-precision alignment stage and automated wedge compensation, the EVG®610 ensures consistent and accurate results. Its motorised, recipe-controlled exposure gap and support for the latest UV-LED technology enhance process flexibility. The system's compact design minimises facility requirements, and its multi-user interface supports multiple languages and remote diagnostics, making it ideal for academic and research environments.

Features:

• Wafer/substrate size from pieces up to 200 mm/8’’
• Top-side and bottom-side alignment capability
• High-precision alignment stage
• Automated wedge compensation sequence
• Motorized and recipe-controlled exposure gap
• Supports the latest UV-LED technology
• Minimized system footprint and facility requirements
• Step-by-step process guidance
• Remote tech support
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Agile processing and conversion re-tooling
• Table top or stand-alone version with anti-vibration granite table
• Additional capabilities:
• Bond alignment
• IR alignment
• Nanoimprint lithography (NIL)

Applications:

• Photolithography / Mask Aligner for Resist Patterning
  The EVG 610 is used to pattern photoresist on substrates via mask exposure (UV) with alignment (top or bottom). This is a standard first step in micro/nanofabrication to define features.
  
  
• Double-Sided / Back-Side Lithography
  Because it supports bottom-side (back-side) alignment, the EVG 610 can align and expose features on the reverse side of a wafer or substrate, enabling double-sided device structures.
  
  
• Wafer / Substrate Bond Alignment        
  It can perform alignment for bonding operations (e.g. wafer-to-wafer, die-to-wafer), helping align two substrates precisely before bonding. 
  
  
• Nanoimprint Lithography (NIL / UV-NIL)        
  The system supports UV-based nanoimprint lithography: stamping a nano-scale pattern from a mold (stamp) onto a resist using imprint + UV curing, leveraging its alignment and exposure capabilities. 
  
  
• Prototyping / Research / Academia      
  Because of its flexibility, re-tooling speed, and support for multiple modes, it’s often used in university clean rooms, research labs, and pilot-line environments to develop new process flows or test new materials. 
  
  
• Advanced Packaging / MEMS / Sensors / Compound Semiconductors        
  The mask aligner family (including the EVG610) is used in domains such as MEMS, sensors, power devices, compound semiconductors, advanced packaging, etc., to pattern features, align layers, and integrate components. 
  
  
• Migration to Volume Production Processes        
  Because EVG designs the 610 to be compatible with its production-level alignment / bonding tools, processes developed on it can be more readily transferred to manufacturing tools.