EVG®150

The EVG®150 is a fully modular, automated resist processing tool designed for high-throughput spin, spray, and develop processes. Its ultra-compact footprint of less than 3 m², combined with a redesigned modular structure, ensures easy access to individual chambers and robot areas for streamlined operation and maintenance. The system features four wet processing modules and up to 20 bake/chill units, providing outstanding throughput for real-life processes. A high-speed, high-accuracy robot, along with advanced scheduler algorithms, enables maximum throughput while maintaining exceptional process quality. Despite its compact design, the EVG®150 can accommodate up to 12 pumps and resist bottles within the main frame, ensuring a highly flexible and scalable solution. The system guarantees uniform coatings across a wide range of applications—from thick resists to sub-micron layers—and is ideal for wafers with high topography, thanks to EVG’s proprietary OmniSpray™ ultrasonic atomisation technology. With up to four XY spray coat modules, the EVG®150 delivers unrivalled spray coating throughput, making it the perfect choice for applications in MEMS, image sensors, advanced packaging, RF, 5G, 3D sensing, photonics, automotive, and power electronics manufacturing.

Features:

• Wafer sizes up to 300 mm Up to six process modules
• Customizable number - up to twenty bake/chill/vapor prime stacks
• Up to four FOUP load ports or cassette loading
• Available modules include Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor/Prime
• EV Group’s proprietary OmniSpray® ultrasonic atomization technology provides unmatched process results when it comes to conformal coating of extreme topographies
• Optional NanoSpray™ module achieves conformal coating of 300-micron deep patterns with aspect ratios up to 1:10 and vertical sidewalls
• Extensive range of supported materials
• Bake modules for up to 250 °C
• Megasonic technology for cleaning, sono-chemical processing and developing improves process efficiency and lowers the process time from hours to minutes
• Sophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughput
• Handling of thick or ultra-thin, fragile, bowed or small-diameter wafers
• Versatile combinations of multi-functional modules for spin and spray coating, developing, bake and chill provide great opportunities in many fields of application EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)
• Process technology excellence and development service
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Smart process control and data analysis feature [Framework SW Platform]
• Integrated analysis features for process and machine control
• Equipment and process performance tracking feature
• Parallel/queueing task processing feature
• Smart handling features
• Occurrence and alarm analysis
• Smart maintenance management and tracking

Applications:

• MEMS / microsystems        
  Many MEMS devices have complex topography (trenches, cavities). The spray / OmniSpray capabilities help coat these uniformly.
  
  
• Image sensors / photonics        
  High-uniformity resist coating & development is critical for pattern fidelity, overlay, optical elements, etc.
  
  
• Advanced packaging / 3D integration      
  In packaging, resist layers may be applied over non-flat surfaces, bumps, vias — the modular and coating features help.
  
  
• RF / 5G / high-frequency devices
  Devices with varying topography, mixed materials, and stringent process control benefit from the versatility.
  
  
• Power electronics / automotive        
  These often use larger features, possibly thick resist layers, robust patterning, sometimes uneven substrates.
  
  
• General semiconductor back-end / lithography flows        
  Any process needing reliable, repeatable, high-throughput resist coating & development can use EVG 150.
  
  
• High-topography / non-planar devices        
  Where classical spin coating fails (due to height variations), spray or ultrasonic coating helps.
  
  
• R&D → production bridging
  Because it’s modular and configurable, it’s suited both for research / development (trying new resists, flow changes) and small-volume production.
  
  
• Multi‑project / mixed substrate processing        
  Its flexibility, modularity, and support for varying substrate shapes / sizes make it useful in multi-user / multi-discipline facilities.