EVG®105

The EVG®105 bake module is designed for post-exposure bake, softbake, and hardbake processes, ensuring uniform evaporation within a precisely controlled environment. Programmable proximity pins provide optimal control over temperature profiles and resist hardening, delivering superior process consistency. The EVG®105 can process up to four 100 mm wafers or a single 300 mm wafer concurrently, making it a versatile solution for high-efficiency processing in a variety of applications.

Features:

• Stand-alone bake module Up to 300 mm wafer size or up to four 100 mm wafers at the same time
• Temperature uniformity ≤ ± 1 °C @ 100 °C, up to 250 °C bake temperature
• Loading pins for manual and safe wafer loading/unloading
• Timer for bake
• Substrate vacuum (direct contact bake)
• N2 purge and proximity bake 0-1 mm distance wafer to heat plate optional
• Irregular shaped substrates

Applications: 

• Soft Bake
  After resist spin or coating, to drive off solvent and stabilize resist before exposure.
  
  
• Post‑Exposure Bake (PEB)
  After exposure, when resist chemistry requires thermal activation (e.g. in chemically amplified resists) or diffusion of species for contrast enhancement.
  
  
• Hard Bake
  After development, to harden/anneal the resist, reduce edge roughness, improve adhesion or stability.
  
  
• Process Development & R&D
  In research labs or development fabs, having a dedicated bake module allows tuning of bake temperatures, proximity gaps, gas environment (e.g. N₂ purge) to optimize resist performance, crosslinking, stress, film properties, etc.
  
  
• Support for Irregular / Non‑Standard Substrates
  Since the EVG 105 supports irregular shaped substrates (not just circular wafers), it is useful where the substrate is nonstandard (cut pieces, dies, custom shapes) and still requires precise baking.
  
  
• Integration into Larger Lithography / Resist Systems
  As a module, it can be integrated into a larger resist processing line or cluster, so that coating → bake → exposure → develop processes are executed in a controlled, modular fashion.
  
  
• Minimizing Contamination / Atmospheric Control
  The N₂ purge option allows control over ambient gas (e.g. reducing moisture, oxygen) during baking, which can improve resist stability, reduce defects, and improve reproducibility.
  
  
• High Uniformity / Precision Applications
  In applications where resist thickness uniformity, controlled crosslinking, edge effects, and thermal gradients matter (e.g. advanced lithography, nanoimprint pre-bake, MEMS), the ±1 °C uniformity and proximity control are beneficial.