EVG®101

What is the EVG®101?

The EVG®101 is a versatile resist processing system designed for R&D applications, fully compatible with EVG's automated systems for straightforward transfer from research to production. It supports wafer sizes from small pieces and square or round substrates up to 300 mm, with configurations for spin coating, spray coating, and developing.

IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®101 for customers across the UK.

What coating technology does it use?

The EVG®101 is equipped with EVG's advanced OmniSpray™ coating technology, achieving conformal layers of polymers or photoresists on 3D structured wafers. This minimises material consumption of high-viscosity photoresists and polymers, while improving resist spreading and uniformity for enhanced process control. A syringe dispense system allows use of small resist volumes, including high-viscosity resists.

What makes it suitable for R&D use?

Its proven modular design and standardised software allow quick and easy process transfer from research to production, while a small footprint maintains a high level of personal and process safety. A multi-user concept (unlimited user accounts and recipes, assignable access rights, multiple UI languages) supports shared lab environments, and wafers are manually loaded and unloaded for automated spin, spray, or develop processes.

What optional configurations are available?

Options include uniform coating of high-topography wafer surfaces with OmniSpray® technology, wax and epoxy coating for subsequent bonding processes, and Spin-On-Glass (SOG) coating.

Where can I buy or get support for the EVG®101 in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®101 and the wider EVG resist processing and lithography portfolio.

Features:

• Wafer size up to 300 mm
• Automated spin or spray coating or developing with manual wafer load/unload Quick and easy process transfer from research to production utilizing proven modular design and standardized software
• Syringe dispense system for utilization of small resist volumes, including high-viscosity resists
• Small footprint while maintaining a high level of personal and process safety
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Options:
• Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology
• Wax and epoxy coating for subsequent bonding processes
• Spin-On-Glass (SOG) coating

Applications:

• R&D / Prototyping of Lithographic Processes
  It’s ideal in research labs or small cleanrooms for experimenting with new resist formulations, coating/development recipes, novel substrates, or patterning schemes.
  
  
• Translational / Pilot Processing
  Because it is compatible with EVG production tools, the same process recipes developed on the EVG 101 can be transferred to larger, more automated tools (for scale-up).
  
  
• High-Topography / 3D Structures
  In microelectromechanical (MEMS), microfluidics, or through-wafer features, surfaces may have steep steps or deep trenches. The OmniSpray capability helps deposit resist conformally over such topographies, where standard spin coating might fail.
  
  
• Handling Thick & High-Viscosity Resists / Polymers
  Some applications require thick coatings (e.g. high aspect ratio resist structures or sacrificial layers). The ability to handle high viscosities (~52,000 cP) makes it suitable for such use.
  
  
• Special Coatings / Bonding Preparations 
  It supports coating of wax, epoxy, spin-on-glass (SOG), edge-protection coatings, etc. These might be used in bonding, temporary adhesive layers, or in multi-step integration flows.
  
  
• Flexible Substrate Shapes 
  Since it can handle rectangular, square, or even irregular shaped substrates (not just circular wafers), it’s useful in non-traditional formats (e.g. sensor chips, pieces) where standard wafer tools might not be ideal. 
  
  
• Edge / Bead Control & Uniformity Optimization
  Applications needing tight uniformity control (sub-micron resist thickness variation) benefit from features like edge bead removal, backside rinse, and advanced dispense control.
  
  
• Integration with Lithography / Imprint Processes
  In workflows where you need resist coating (or resist development) immediately before or after patterning/imprint, having an integrated or compatible resist tool helps reduce transfer steps, contamination, or misalignment.