scia Coat 200

The scia Coat 200 delivers exceptional uniformity for coatings on substrates up to 200 mm. Utilizing ion beam sputter deposition, it ensures the creation of smooth, defect-free films, surpassing traditional deposition processes. In-situ optical monitoring guarantees superior process stability. The system also supports the handling of both wafers and arbitrary-shaped substrates, making it versatile for a wide range of applications.

Key features:

• Excellent uniformity by substrate rotation and tilt
• Up to 5 water-cooled target materials on a rotational holder for in-situ change
• Recipe-controlled multilayer deposition with quartz crystal oscillator and/or optical thickness monitor (OTM) and test glass changer
• Direct wafer handling or adaptation to variable substrate sizes with carrier handling
• Equipped with a 350 mm ion beam source as assist source, also usable for ion beam etching processes

Technical Data:

• Substrate size (up to) - 200 mm dia.
• Substrate holder - Water-cooled, helium backside cooling contact, substrate rotation 5 to 20 rpm, tiltable in-situ from 0° to 160° in 0.1° steps
• Ion beam sources - Sputter source: 120 mm circular RF source (RF120-e)
  Assist source: 120 mm circular RF source (RF120-e) or
  350 mm circular RF source (RF350-e) or
  218 mm circular microwave ECR source (MW218-e)
• Neutralizer - Filament driven (N-DC) or RF driven (N-RF) plasma bridge neutralizer
• Target holder - Target drum with tiltable and water-cooled targets,
  up to 5 (each max. 220 mm dia.) or up to 4 (each max. 300 mm dia.)
• Typical deposition rates - Ag: 35 nm/min, Al: 10 nm/min, Si: 15 nm/min, Ti: 8 nm/min,
  Al2O3: 15 nm/min, SiO2: 20 nm/min, Ta2O5: 15 nm/min, TiO2: 6 nm/min
• Uniformity variation - ≤ 0.5 % (σ/mean)
• Base pressure - < 5 x 10-7 mbar
• System dimension:
  (W x D x H)
  3.10 m x 1.70 m x 2.40 m, for single chamber with cassette handling
  (without electrical rack and pumps)
• Configurations - Single chamber with single substrate load lock or cassette handling,
  cluster system with cassette handling
• Software interfaces - SECS II / GEM, OPC

Applications 

• Precision optics / photonics
  For example, optical high- and anti-reflective coatings, bandpass and notch filters, multilayer mirror stacks.
  
  
• Magnetic sensors / spintronics
  Multilayer films for GMR (Giant Magneto-Resistive), TMR (Tunnel Magneto-Resistive) sensors, and related devices. 
  
  
• Microelectronics / MEMS / semiconductor research
  The tool is also used for dielectrics and metal layers deposition in research & production of advanced devices. For example, the system’s purchase by NIST for microfabrication. 
  
  
• Advanced coatings / functional films
  Additional use-cases include deposition of metal oxides (transparent, conductive, resistive) with precise stoichiometry, for example via dual ion beam sputtering (DIBS).