Phoenix

The Phoenix® system is designed to deliver high throughput and consistent uptime in demanding production environments—ranging from pilot-scale setups to full industrial manufacturing lines. Engineers and researchers choose Phoenix® for its precision and reliability in depositing uniform films on both flat and complex 3D substrates. With support for up to six independent precursor lines, the system handles a wide range of solid, liquid, and gaseous chemistries to suit diverse thin film applications. Thanks to its compact footprint and robust engineering, the Phoenix® is an ideal solution for batch production ALD, where space, consistency, and performance are critical.

<h3>Key features include:</h3>

<ul><li>Precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates</li><li>Patented ALD Shield™ vapor trap to prevent build-up of deposits and minimizes excess process gases from being exhausted into the environment</li><li>Large process chamber accepts GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects</li><li>Low cost of ownership with minimal startup and operational costs</li><li>Compact footprint that conserves valuable clean room space</li><li>Standard recipes and ALD materials readily available</li><li>Comprehensive support and services worldwide from technical team and PhD scientists</li><li>CE, FCC, and CSA compliant with many built-in safety features</li></ul>

<h3>Technical specifications</h3>

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<td><strong>Substrate Size</strong></td>
<td>Up to 370 mm x 470 mm (Gen 2.5 Panels)<br>Up to 360 wafers – 100 mm (cassette)<br>Up to 160 wafers – 150 mm (cassette)<br>Up to 100 wafers – 200 mm (cassette)<br>Up to 40 wafers – 300 mm (cassette)<br>Custom holders for 3D objects</td>
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<td><strong>Dimensions (W x L x H)</strong></td>
<td>900 mm x 1370 mm x 1700 mm</td>
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<td><strong>Cabinet</strong></td>
<td>Vented cabinet with smoke detection</td>
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<td><strong>Power</strong></td>
<td>208 VAC 3 Phase, 8500 W (excluding pump)</td>
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<td><strong>Control</strong></td>
<td>Windows™ PC</td>
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<td><strong>Substrate Temperature</strong></td>
<td>Up to 285º C</td>
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<td><strong>Deposition Uniformity (AI₂0₃)</strong></td>
<td>≤2%</td>
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<td><strong>Vacuum Pump</strong></td>
<td>Dry pump ≥350 CFM</td>
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<td><strong>Compatibility</strong></td>
<td>Cleanroom compatible</td>
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<td><strong>Precursor Delivery System</strong></td>
<td>Standard 4 lines accommodate solid, liquid and gas precursors<br>Lines independently heated up to 200°C</td>
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<td><strong>Valves</strong></td>
<td>High speed ALD valves</td>
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<td><strong>Precursor Cylinders</strong></td>
<td>3.1 l or 600ml cylinders</td>
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<td><strong>Carrier/Venting Gas</strong></td>
<td>N₂&nbsp;or Ar MFC flow control</td>
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<td><strong>Chamber Volume (L x W x H)</strong></td>
<td>(50cm, 40cm,24cm)</td>
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• Semiconductor / electronics manufacturing Ultra-thin dielectric films, barrier layers, seed films for advanced node devices. ALD is key in advanced CMOS, memory, 3D architectures. 3D structures in semiconductors (e.g., FinFET, 3D NAND) where conformality is critical.Flat or large panel processing may also be used for back-end packaging, or large-format substrates in advanced packaging.
  
  
• Display and large-area electronics Because the Phoenix supports large panels (e.g., 370×470 mm), this opens up display applications, or large-format electronics, e.g., thin-film coatings for displays, flexible electronics. Conformal coatings for large area or 3D substrate surfaces.
  
  
• MEMS, sensors and micro-devices Small but complex 3D geometries are well served by ALD. MEMS devices, sensors (gas, biosensors), micro-electro-mechanical systems benefit from highly uniform films. Protective coatings, dielectric layers, or functional films in sensor components.
  
  
• Optical / Photonics applications Thin films for optical coatings (anti-reflection, reflectors, waveguides) can benefit from ALD uniformity and control. Photonics devices often require precise thin films on various substrates (including 3D) where ALD adds value.
  
  
• Power electronics / advanced packaging In power devices or advanced packaging (e.g., SiC, GaN, or 3D packaging), you may need conformal dielectric/barrier layers, encapsulation coatings, etc. The Phoenix system’s ability for batch processing and large substrate size supports these. The low cost-of-ownership and throughput aspects are favourable for production in these sectors.
  
  
• Emerging applications & large-scale production beyond just semiconductors The broader ALD application list from Veeco includes energy (solar, battery), biomedical, nanostructures. So for example: encapsulation of flexible electronics, thin‐film coatings for battery electrodes, protective coatings for biomedical devices.