Q240

What is the Q240?

The Q 240 is the largest member of the Q-series, optimised for handling multiple wafers up to 200 mm in diameter. It shares the same chamber diameter as the Q240S but with a reduced chamber depth, saving space without compromising capacity, and features a modified resonator design for more concentrated, effective surface treatment and plasma generation. Designed with a quartz glass process chamber, it's built to accommodate high-throughput plasma processing in demanding industrial and research environments.

IES represents Alpha Plasma in the UK, Benelux, Ireland, and Scandinavia, supplying, installing, and supporting the Q240 for customers across these regions.

How does it compare to other Q-series systems?

As the flagship of the Q-series ("Q" denotes quartz glass chambers), the Q240 sits above the Q150, Q235, and Q240S in capacity, purpose-built to process multiple 200 mm wafers simultaneously rather than single substrates.

What is it typically used for?

Like other Q-series systems, typical applications include removal of photoresist after high-dose implantation, surface preparation before or after wet or dry etching, processing of SU-8 and other epoxy-based resists, and creation of sacrificial layers in MEMS fabrication — scaled up for higher throughput across multiple wafers per run.

Where can I buy or get support for the Q240 in the UK?

As Alpha Plasma's representative in the UK, Benelux, Ireland, and Scandinavia, IES provides sales, installation, and engineering support for the Q240 and the wider Alpha Plasma equipment portfolio.

Key Features:

High-Capacity Processing

• Processes up to 50 wafers (≤ 200 mm diameter) simultaneously—perfect for research, prototyping, or small-scale production.

Robust Process Chamber

• A quartz glass cylinder with a 240 mm inner diameter and 450 mm internal depth, providing a generous 20-liter volume.

Compact Footprint & Solid Build

• Dimensions: 760 mm (L) × 775 mm (W) × 775 mm (H), weighing 100 kg—ideal for cleanroom table or wall installation.

Advanced Microwave Power

• Operates at 2.45 GHz, with adjustable power output ranging from 50 W to 1,200 W, enabling flexible control over plasma density and energy.

Flexible Gas Handling

• Includes one internal gas channel by default, expandable to three channels for multi-gas process recipes.

Optional Substrate Support

• Features a customizable aluminum wafer holder tailored to your specific workflow and wafer layout needs.

Vacuum & Venting Infrastructure

• Equipped with a DN 40 ISO-KF vacuum connection and electromagnetic solenoid valve venting for precise atmosphere control.

Technical Data:

• Dimensions: L: 760mm W: 775mm H: 775mm
• Weight: 100 KG
• Volume: 20 Liter
• Process chamber: quartz glass, 240mm Ø, B: 450mm
• Microwave output: 2,45 GHz / 50 - 1200 Watt
• Inclusive: 1 gas channel (gas distribution system inside the process chamber), up to 3 channels available
• Substrate holder (optional): aluminium, custom design possible
• Vacuum connection: DN 40 ISO-KF
• Venting: electromagnetic solenoid valve
• Pump system: up to 40m³/h
• Chamber door: you can choose between hinged-type with viewing port and drawer door with attached support rods
• Wafer size: up to 200mm, at a number of 50 wafers

Applications:

• Semiconductor / MEMS manufacturing: Wafer sizes up to 200 mm and the process steps (resist removal, etching) make it a natural fit.
  
  
• Micro-electronics / sensor modules: Where wafers or substrate circular formats up to ~200 mm are used.
  
  
• R&D / pilot lines: For labs working on device prototypes, needing a compact but high-quality plasma system.
  
  
• Clean-room component manufacturing: For example, in packaging, post‐implant cleaning, or surface prep of wafers or devices.
  
  
• Advanced materials / surface science: Where high-purity plasma systems are required to treat surfaces or thin‐films before coating or bonding.