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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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AL76 Compact for Packaging Applications

The Alpha Plasma System AL 76 is a high-performance, industrial-grade microwave plasma system that excels in surface treatment and adhesion optimisation across multiple industries. Its robust construction, versatile processing capabilities, and modular enhancements make it a powerful solution for large-scale manufacturing, prototyping, and R&D workflows.

Key Features:

Versatile Surface Treatment

  • Ideal for comprehensive surface cleaning and modification—converts surfaces from hydrophobic to hydrophilic and vice versa via plasma polymerisation.
  • Enhances adhesion for bonding and welding across virtually any substrate.

Wide-Ranging Industrial Applications

Offers reliable performance for high-tech sectors including:

  • Medical devices
  • Flat-panel displays
  • New-energy battery systems
  • Automotive manufacturing
  • Solar cell production
  • Rubber, plastic, and metal pretreatment

Technical Data:

  • Process chamber: Aluminum
  • Volume: 76 liters
  • Chamber size: W 400 mm × D 490 mm × H 400 mm
  • Chamber door: Drawer-type with viewing port
  • Microwave power: 2.45 GHz, adjustable between 50 and 1200 Watts
  • Options:

    • Vacuum pump
    • Gas Channel
    • Rotary table
    • ECR set-up

  • Utilities: 3/N/PE AC 50 Hz 400/240 V 16 A
  • Dimensions: W 770 mm × D 780 mm ×H 780 mm (incl. light tower)

Applications:

  • Semiconductor & Microelectronics Wafer cleaning, resist residue removal, pre-coat/bond surface prep.

  • MEMS & Sensors Cleaning/activation of microstructures, surface prep for bonding/encapsulation.

  • LED / OptoelectronicS LED wafer cleaning, substrate preparation for optics or packaging.

  • Advanced Packaging Surface treatment prior to flip-chip, underfill, wire bond attach, encapsulation.

  • Photonics & Optics Cleaning and activation of optical substrates, sensor packaging.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.