Q240S
What is the Q240S?
The Q 240S is a compact and streamlined variant of the flagship Q-series plasma systems. It retains the same generous chamber diameter as other large-format Q-series systems, while featuring a reduced depth — making it an excellent choice for labs and production lines where space efficiency is critical. IES represents Alpha Plasma in the UK, Benelux, Ireland, and Scandinavia, supplying, installing, and supporting the Q240S for customers across these regions.
How does it fit within the Q-series range?
As part of the Q-series ("Q" denoting quartz glass chambers), the Q240S offers the same large-diameter processing capacity associated with Alpha Plasma's bigger systems, but in a shallower, more compact chamber footprint — a practical option where floor space or bench depth is limited.
What is it typically used for?
Like other Q-series systems, typical applications include removal of photoresist after high-dose implantation, surface preparation before or after wet or dry etching, processing of SU-8 and other epoxy-based resists, and creation of sacrificial layers in MEMS fabrication.
Where can I buy or get support for the Q240S in the UK?
As Alpha Plasma's representative in the UK, Benelux, Ireland, and Scandinavia, IES provides sales, installation, and engineering support for the Q240S and the wider Alpha Plasma equipment portfolio.
Key Features:
Optimized Footprint
- Shares the larger Q-series chamber diameter but with a shallower design, delivering high processing capability in a smaller overall unit.
Space-Savvy Dimensions & Weight
- Dimensions (L × W × H): 620 × 550 × 500 mm
- Weight: 75 kg, significantly lighter than its full-depth counterpart.
Technical Data:
- Dimensions: L: 620mm W: 550mm H: 500mm
- Weight: 75 KG
- Volume: 9 Liter
- Process chamber: Quarzglas, 240mm Ø , B: 244mm
- Microwave output: 2,45 GHz / 50 - 1200 Watt
- Inclusive: 1 gas channel (gas distribution system inside the process chamber), up to 3 channels available
- Substrate holder (optional): aluminium, custom design possible
- Vacuum connection: DN 40 ISO-KF
- Venting: electromagnetic solenoid valve
- Pump system: up to 25m³/h
- Chamber door: you can choose between hinged-type with viewing port and drawer door with attached support rods
- Wafer size: up to 150mm, at a number of 25 wafers
Applications:
- Semiconductor manufacturing and wafer packaging: For wafers up to ~200 mm diameter, for resist removal, MEMS, sensors.
- Micro-electronics / MEMS devices: Small devices, devices built on wafer format, requiring clean environment and minimal footprint machines.
- Advanced sensor / photonics industries: Where circular substrates or wafer formats are common, and clean plasma treatment is needed.
- R&D / pilot production: Facilities where space is limited and full-sized large chambers may not be justified but high-quality plasma treatment is still required.
- Clean-room environments in automotive, medical, aerospace electronics: When high cleanliness and reliable surface prep are required, though on smaller substrates rather than large modules.