Q235 M
What is the Q235?
The Q 235 is a high-precision, low-damage microwave plasma etcher engineered for the semiconductor and microelectronics industries. Featuring a quartz chamber with a 235 mm diameter and 11 L volume, it offers efficient processing for wafers up to 200 mm while maintaining the integrity of delicate substrates. IES represents Alpha Plasma in the UK, Benelux, Ireland, and Scandinavia, supplying, installing, and supporting the Q235 for customers across these regions.
How does microwave plasma generation benefit sensitive substrates?
Like the rest of the Alpha Plasma Q Series, the Q235 uses microwave plasma generation at 2.45 GHz, where the plasma effect is based on chemical reactions of reactive plasma particles rather than aggressive physical bombardment — enabling fast, damage-free processing that preserves delicate substrate surfaces.
How is it operated?
The system is easy to operate, with straightforward loading and unloading, either manually or automatically, and Windows-based software that complies with semiconductor industry standards. It can be configured for cleanroom wall installation or as a table-top unit.
What is it typically used for?
Typical applications include removal of photoresist after high-dose implantation, surface preparation before or after wet or dry etching, processing of SU-8 and other epoxy-based resists, and creation of sacrificial layers in MEMS fabrication.
Where can I buy or get support for the Q235 in the UK?
As Alpha Plasma's representative in the UK, Benelux, Ireland, and Scandinavia, IES provides sales, installation, and engineering support for the Q235 and the wider Alpha Plasma equipment portfolio.
Applications
- Photoresist processing;
- Isotropic low-damage plasma etch;
- Dry etch surface preparation;
- SU8 and other epoxy based resists;
- Sacrificial layers for MEMS.
Features
- Efficient microwave plasma cleaning
- Small footprint for R&D purposes
- 2.45 GHz microwave power adjustable between 50 and 600 Watts
- Up to 4 mass flow controllers
- Automatic and manual operation
- Substrate size up to 8inch
- Optional VAT process pressure control valve 25 wafer loading