AL900

What is the AL900 Control Active?

The AL 900 Control Active is an advanced, high-throughput desmearing plasma system engineered for efficient and uniform cleaning of large circuit board panels. Built for demanding industrial and R&D settings, it delivers powerful, customisable plasma desmearing through a robust, precision-controlled platform. IES represents Alpha Plasma in the UK, Benelux, Ireland, and Scandinavia, supplying, installing, and supporting the AL900 Control Active for customers across these regions.

What does desmearing achieve for PCB manufacturing?

Desmearing removes resin residues ("smear") left behind after drilling vias through PCB panels. Left untreated, this residue can impair electrical connectivity between layers, weaken copper plating adhesion inside the via, and cause latent open connections in high-density boards. Plasma desmearing clears via walls without damaging copper inner layers, making it well suited to high-density, fine-pitch vias and substrates such as PTFE, polyimide, and RF materials, where traditional wet chemistry often falls short.

How does the AL900 Control Active ensure consistent results across large panels?

Operating in a controlled low-pressure environment, the system ensures every via across the entire panel is treated equally, giving uniform desmearing results at scale rather than variable cleaning across different areas of a large board.

Why is it suited to demanding production environments?

Its robust, precision-controlled platform is built for high-throughput industrial use as well as R&D settings, with customisable process parameters to suit different panel sizes, materials, and via densities.

Where can I buy or get support for the AL900 Control Active in the UK?

As Alpha Plasma's representative in the UK, Benelux, Ireland, and Scandinavia, IES provides sales, installation, and engineering support for the AL900 Control Active and the wider Alpha Plasma equipment portfolio.

Key Features:

Large Processing Volume

• A capacious 900 L treatment chamber enables high-volume throughput for large-format substrates or multiple panels simultaneously. 

Industrial-Scale Dimensions

• Footprint: 1,800 mm L × 1,500 mm W × 1,700 mm H
• Weight: 620 kg 

Multi-Panel Capability

• Designed to process up to 18 circuit boards measuring 18 × 24″ or 20 × 24″ at once, significantly boosting productivity. 

Dual Power Sources for Versatile Plasma Generation

• Low-Frequency (LF): 40 kHz, up to 10 kW—ideal for high-density ion generation.
• Microwave: 2.45 GHz, adjustable output from 50 to 1,200 W—for fine-tuned plasma control. 

Integrated Gas Distribution System

• Comes standard with 3 gas channels, with options to expand up to 7 channels, enhancing flexibility for different process gases and recipes. 

Modular Substrate Handling

• Optional custom-designed aluminum substrate holders allow greater flexibility and adaptability for diverse panel sizes or shapes. 

Robust Vacuum & Venting Infrastructure

• Vacuum interface: DN 250 ISO-KF connection
• Venting: via electromagnetic solenoid valve—ensuring precise pressure control and rapid cycle times. 

User-Friendly Design

• The hinged chamber door includes a viewing port for safe, convenient loading/unloading and visual process monitoring.

Technical Data:

• Dimensions: L: 1800mm W: 1500mm H: 1700mm
• Weight: 620 KG
• Volume: 900 Liter
• Porcess chamber: aluminum with electron cage:
• circuit boards: up to 18 panels mit 18x24" or 20x24"
• LF-output (Low Frequency): operating frequency = 40 KHz, up to 10 kW
• Microwave output: 2,45 GHz / 50 - 1200 Watt
• Inclusive: 3 gas channel (gas distribution system inside the process chamber), up to 7 channels available
• Substrate holder (optional): aluminium, custom design possible
• Vacuum connection: DN 250 ISO-KF
• Venting: electromagnetic solenoid valve
• Pump system: up to 600m³/h
• Chamber door: hinged-type with viewing port

Applications:

• Electronics manufacturing / PCB fabrication: For companies manufacturing multilayer PCBs, HDI boards, complex interconnect substrates.
  
  
• Automotive electronics: Many automotive modules require high reliability; desmearing helps ensure durability under vibration/temperature.
  
  
• Aerospace & defence electronics: Where reliability and traceability are critical, and board failures are very costly.
  
  
• Consumer electronics (higher end): For premium devices where board reliability is important (though perhaps smaller scale than automotive).
  
  
• Medical electronics / implantable modules: Similar reason: high reliability, clean board finish, no delamination – desmearing helps.
  
  
• Other substrates with drilled holes requiring cleaning: Not just PCBs – potentially other laminated assemblies with drilled vias or holes needing clean surfaces for bonding/ plating.