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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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AL235

The Alpha Plasma System AL 235 is a robust, high-capacity aluminum-chamber plasma solution designed for enhanced ergonomics and automation in demanding R&D and production environments. It elevates the AL-series by integrating features that simplify sample handling and processing, making it ideal for medium-to-large format applications across industries like semiconductors, electronics, solar, and plastics.

Key Features:

Automated Door System

  • Incorporates a motorised or automated door mechanism for more efficient, safe, and user-friendly loading and unloading of substrates. 

Adjustable Work Height

  • Designed with an adjustable working surface to accommodate operators of varying heights and reduce repetitive strain, improving ergonomics and workflow. 

Large-Scale Processing Capability

  • Builds on the AL-series’ reputation for handling larger substrate sizes, leveraging aluminum chamber construction for durability and effective process control.

Technical Data:

  • Dimensions: L: 1200mm W: 2700mm H: 1850mm
  • Weight: 380 KG
  • Volume: 235 Liter
  • Process chamber: L: 650 W: 650 H: 550
  • Microwave output: 2,45 GHz / 1200 and 1450 Watt
  • Inclusive: 1 gas channel (gas distribution system inside the process chamber), up to 3 channels available
  • Substrate holder (optional): aluminium, custom design possible
  • Vacuum connection: DN 100 ISO-K
  • Venting: electromagnetic solenoid valve
  • Pump system: 50 -600 m³/h process-dependent
  • Chamber door: Automatic door

Applications:

  • Semiconductor / wafer processing / packaging – for wafers, modules or maybe large substrates needing plasma treatment. The AL series is explicitly targeted at semiconductor/solar/plastics/electronics industries. 

  • Electronics / PCBs / module manufacturing – larger boards or modules (e.g., for IoT, automotive electronics) needing surface prep/coating.

  • Solar / photovoltaics – large flat substrates, cleaning/activation of solar cell modules or components prior to assembly or coating. The AL‐series mention solar in their brochure. 

  • Plastics / polymer components – when you have larger plastic parts or assemblies that need plasma-treatment (cleaning, activation) before coating or bonding.

  • Automotive / aerospace components – When there are large parts (sensor modules, assemblies) requiring good surface condition before protective coatings or bonding. The automatic door and larger chamber make it more compatible with such applications.

  • Medical / harsh‐environment coatings – If you have moderate to large size parts requiring ultra-clean surfaces or special coatings (e.g., conformal coatings, parylene) then this system is a good fit.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.