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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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HERCULES NIL

The HERCULES® NIL 200mm system is the industry standard for high-volume nanoimprint lithography, combining EVG’s proprietary SmartNIL™ imprinting technology with essential pre-processing steps, including cleaning, resist coating, and baking. Built on a modular platform, the system offers tunable configurations that maximize throughput while maintaining a low footprint, providing the most cost-effective solution for large-scale production. Equipped with advanced handling systems, the HERCULES® NIL 200mm delivers highly efficient processing on a 200mm platform. The system also includes the capability to fabricate multiple-use soft stamps, a critical element for high-volume production, without requiring additional equipment for imprint stamp manufacturing. Supporting a wide range of applications, including optical devices for AR/VR headsets, 3D sensors, biomedical devices, nanophotonics, plasmonics, and metasurfaces, the HERCULES® NIL provides a complete NIL solution for high-volume manufacturing. With its innovative design and robust capabilities, the HERCULES® NIL strengthens EVG’s leadership in full-area NIL equipment solutions for next-generation technologies.

Features:

  • Volume manufacturing of structures down to 40 nm* and smaller
  • Combines pre-processing (clean / coat / bake / chill) and SmartNIL®
  • Volume-proven imprinting technology with superior replication fidelity
  • Fully automated imprinting and controlled low-force detachment for maximum working stamp reusability
  • Includes working stamp manufacturing capability
  • Fastest curing times due to high-power light source
  • Optimized modular platform for high throughput *resolution dependent on process and template

Applications:

  • Optical Devices 
    Manufacturing of wire grid polarizers and other optical components for displays and imaging systems.

  • Photonic Devices 
    Production of diffractive optical elements (DOEs) and waveguides for photonic circuits.

  • Microfluidics: 
    Fabrication of micro- and nanoscale structures for lab-on-a-chip devices.

  • Biomedical Devices: 
    Development of micro- and nanoscale structures for medical diagnostics and therapeutic applications.

  • Nanophotonics and Metasurfaces
    Creation of advanced materials with tailored optical properties.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.