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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®20

What is the EVG®20?

The EVG®20 provides a rapid, efficient inspection method, particularly for fusion-bonded wafers. Using live IR transmission, it captures an image of the entire wafer in a single shot, enabling void detection with a precision down to a radius of 500 µm — making it an ideal solution for fusion bonding processes. IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®20 for customers across the UK.

How does it measure bond quality?

The EVG®20 supports fully automated bond strength measurements using the Maszara method, ensuring comprehensive analysis of bond quality alongside void detection. An optional bond pin enables live visualisation of direct bonding.

How is it deployed within a process line?

The EVG®20 is available as a stand-alone inspection tool or as an integrated inspection station within EVG's bonding systems, giving flexibility for both dedicated metrology setups and fully integrated process lines.

Where can I buy or get support for the EVG®20 in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®20 and the wider EVG metrology and bonding equipment portfolio.

Features:

  • Live imaging
  • One-shot inspection of the entire wafer
  • Optional bond pin for live visualization of direct bonding
  • Maszara test compatible
  • Void size detection down to 0.5 mm radius

Applications:

  • Fusion Bonding Quality Control
    The EVG®20 is particularly effective for inspecting fusion-bonded wafers, providing detailed insights into bond quality and uniformity.

  • Void Detection
    It identifies voids as small as 500 µm in radius, which is critical for ensuring the structural integrity of bonded layers.

  • Bond Strength Measurement
    The system supports fully automated bond strength measurements using the Maszara test, allowing for precise evaluation of bond robustness.

  • Live Bond Wave Visualization
    With an optional bond pin, the EVG®20 enables real-time visualization of bond wave propagation, aiding in the assessment of bond uniformity and quality.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.

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