EVG®20
The EVG®20 provides a rapid and efficient inspection method, particularly for fusion-bonded wafers. Using live IR transmission, it captures an image of the entire wafer, enabling void detection with a precision down to a radius of 500 µm—making it an ideal solution for fusion bonding processes. Additionally, the system supports bond strength measurements using the Maszara method, ensuring comprehensive analysis of bond quality.
Features:
- Live imaging
- One-shot inspection of the entire wafer
- Optional bond pin for live visualization of direct bonding
- Maszara test compatible
- Void size detection down to 0.5 mm radius
Applications:
- Fusion Bonding Quality Control
The EVG®20 is particularly effective for inspecting fusion-bonded wafers, providing detailed insights into bond quality and uniformity. - Void Detection
It identifies voids as small as 500 µm in radius, which is critical for ensuring the structural integrity of bonded layers. - Bond Strength Measurement
The system supports fully automated bond strength measurements using the Maszara test, allowing for precise evaluation of bond robustness. - Live Bond Wave Visualization
With an optional bond pin, the EVG®20 enables real-time visualization of bond wave propagation, aiding in the assessment of bond uniformity and quality.