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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

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The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Equipment Partners

Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Insights

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EV Group Enquire Now

EVG®40 NT

The EVG®40 NT (stand-alone tool) and AVM (HVM-integrated module) are designed to measure key lithography parameters, such as critical dimensions and bond alignment accuracy. With its high measurement precision, the system ensures compliance with stringent process specifications and enables real-time optimisation of integrated process parameters. Thanks to its versatile measurement capabilities, the EVG®40 NT adapts to a wide range of manufacturing processes, including nanoimprint lithography and wafer-to-wafer bonding. For example, the EVG®40 NT serves as the essential tool for verifying the 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system, completing the product range for highly accurate aligned wafer bonding.

Features:

  • Versatile measurement options for lithography and bonding metrology
  • Alignment verification for bonding and lithography applications
  • Top- to bottom-side microscope for manifold measurement methods
  • Critical dimension (CD) measurement
  • Die-to-die alignment verification
  • Multi-layer thickness measurement
  • High measurement accuracy in vertical and lateral direction
  • High throughput due to specialized calibration routine
  • PC-based measurement and pattern recognition software for highest reliability

Applications:

  • Bond Alignment Verification
    The EVG®40 NT is utilized for verifying alignment accuracy in various bonding processes, including wafer-to-wafer (W2W) and die-to-die (D2D) bonding, ensuring precise alignment for high-quality device fabrication.

  • Critical Dimension (CD) Measurement
    It enables accurate measurement of critical dimensions in lithography processes, essential for maintaining the integrity of nanoscale features in semiconductor devices.

  • Multi-Layer Thickness Measurement
    The system provides capabilities for measuring the thickness of multiple layers, aiding in the assessment of layer uniformity and quality in multi-layer semiconductor
    structures.

  • Die-to-Die Alignment Verification
    The EVG®40 NT supports die-to-die alignment verification, crucial for ensuring the precise placement of dies in advanced packaging applications.

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.

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