EVG®101

The EVG®101 is a versatile resist processing system designed for R&D applications, fully compatible with EVG’s automated systems. Supporting wafers up to 300 mm, the EVG®101 offers configurations for both spray and spin coating, as well as developing. Equipped with EVG’s advanced OmniSpray™ coating technology, the system achieves conformal layers of polymers or photoresists on 3D structured wafers. This technology minimizes material consumption of high-viscosity photoresists and polymers, while improving resist spreading and uniformity for enhanced process control.

Features:

• Wafer size up to 300 mm
• Automated spin or spray coating or developing with manual wafer load/unload Quick and easy process transfer from research to production utilizing proven modular design and standardized software
• Syringe dispense system for utilization of small resist volumes, including high-viscosity resists
• Small footprint while maintaining a high level of personal and process safety
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Options:
• Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology
• Wax and epoxy coating for subsequent bonding processes
• Spin-On-Glass (SOG) coating

Applications:

• R&D / Prototyping of Lithographic Processes
  It’s ideal in research labs or small cleanrooms for experimenting with new resist formulations, coating/development recipes, novel substrates, or patterning schemes.
  
  
• Translational / Pilot Processing
  Because it is compatible with EVG production tools, the same process recipes developed on the EVG 101 can be transferred to larger, more automated tools (for scale-up).
  
  
• High-Topography / 3D Structures
  In microelectromechanical (MEMS), microfluidics, or through-wafer features, surfaces may have steep steps or deep trenches. The OmniSpray capability helps deposit resist conformally over such topographies, where standard spin coating might fail.
  
  
• Handling Thick & High-Viscosity Resists / Polymers
  Some applications require thick coatings (e.g. high aspect ratio resist structures or sacrificial layers). The ability to handle high viscosities (~52,000 cP) makes it suitable for such use.
  
  
• Special Coatings / Bonding Preparations 
  It supports coating of wax, epoxy, spin-on-glass (SOG), edge-protection coatings, etc. These might be used in bonding, temporary adhesive layers, or in multi-step integration flows.
  
  
• Flexible Substrate Shapes 
  Since it can handle rectangular, square, or even irregular shaped substrates (not just circular wafers), it’s useful in non-traditional formats (e.g. sensor chips, pieces) where standard wafer tools might not be ideal. 
  
  
• Edge / Bead Control & Uniformity Optimization
  Applications needing tight uniformity control (sub-micron resist thickness variation) benefit from features like edge bead removal, backside rinse, and advanced dispense control.
  
  
• Integration with Lithography / Imprint Processes
  In workflows where you need resist coating (or resist development) immediately before or after patterning/imprint, having an integrated or compatible resist tool helps reduce transfer steps, contamination, or misalignment.