scia Batch 350

What is the scia Batch 350?

The scia Batch 350 is designed for biocompatible coatings of 3D-shaped substrates. Its flexible carrier concept accommodates different substrate sizes and shapes within a single batch. IES is an equipment partner for scia Systems, supplying, installing, and supporting the scia Batch 350 for customers across the UK.

How does it coat 3D substrates evenly?

The scia Batch 350 uses an RF parallel plate arrangement, with rotation of each substrate ensuring homogeneous coating of all sides. The system is also available with an additional DC bias applied to the substrate holder, giving further control over coating properties.

Why is it suited to medical device treatment?

With a stable, reproducible, and certified process, the system ensures high-quality standards, making it ideal for the treatment of medical objects — where consistent, biocompatible coverage across complex 3D geometries is a critical requirement.

Where can I buy or get support for the scia Batch 350 in the UK?

As an equipment partner for scia Systems, IES provides UK-based sales, installation, and engineering support for the scia Batch 350 and the wider scia Systems ion beam and plasma technology portfolio.

Key Features:

• Coating of different substrate sizes and quantities in batches due to carrier loading
• Two independent RF electrodes for high throughput
• Homogeneous “all-around coating” by individual rotation of each substrate
• Superior barrier performance and fully cohesive film, also during mechanical deformation
• Combination of heating, plasma pre-treatment and PECVD coating
• Flexible gas and RF conditions

Technical Data:

• Substrate size Individual sizes loaded on 2 carriers,
  carrier size up to 350 mm x 240 mm
• Substrate carrier Water-cooled, pulsed DC bias (2 kV, 400 mA)
• Plasma source RF parallel plate arrangement, 13.56 MHz
• Power Supply RF power max. 2 x 600 W
• Electrode setup
  Temperature: Heating up to 400 °C
  Distance: Adjustable between 50 mm
  and 150 mm
• Operation modes Independent or coupled electrodes
• Typical deposition rate SiC: 5 nm/min
• Base pressure < 5 x 10-7 mbar
• System dimension:
  (W x D x H)
  0.90 m x 1.70 m x 2.10 m
  (without electrical rack and pumps)
• Configuration Single chamber with manual loading in batches
• Software interfaces SECS II / GEM, OPC

Applications:

• Precision optics / large-area optical substrates: 
  The Multi 680 supports very large substrates (up to ~680 mm diameter) which are commonly used in optics, mirrors, beam-line components, synchrotron or X-ray optics.
  
  
• Multilayer thin-film coatings: Especially for applications requiring periodic multilayers (e.g., X-ray mirrors, Bragg reflectors, anti-reflective stacks) on large substrates. 
  
  
• High-end manufacturing for niche/large substrates: Because of the ability to handle large and potentially heavy substrates, this tool is suited for production of large optical components rather than just small wafers.