scia Batch 350

The scia Batch 350 is designed for biocompatible coatings of 3D-shaped substrates. Its flexible carrier concept accommodates different substrate sizes and shapes within a single batch. With a stable, reproducible, and certified process, the system ensures high-quality standards, making it ideal for the treatment of medical objects.

Key Features:

• Coating of different substrate sizes and quantities in batches due to carrier loading
• Two independent RF electrodes for high throughput
• Homogeneous “all-around coating” by individual rotation of each substrate
• Superior barrier performance and fully cohesive film, also during mechanical deformation
• Combination of heating, plasma pre-treatment and PECVD coating
• Flexible gas and RF conditions

Technical Data:

• Substrate size Individual sizes loaded on 2 carriers,
  carrier size up to 350 mm x 240 mm
• Substrate carrier Water-cooled, pulsed DC bias (2 kV, 400 mA)
• Plasma source RF parallel plate arrangement, 13.56 MHz
• Power Supply RF power max. 2 x 600 W
• Electrode setup
  Temperature: Heating up to 400 °C
  Distance: Adjustable between 50 mm
  and 150 mm
• Operation modes Independent or coupled electrodes
• Typical deposition rate SiC: 5 nm/min
• Base pressure < 5 x 10-7 mbar
• System dimension:
  (W x D x H)
  0.90 m x 1.70 m x 2.10 m
  (without electrical rack and pumps)
• Configuration Single chamber with manual loading in batches
• Software interfaces SECS II / GEM, OPC

Applications:

• Precision optics / large-area optical substrates: 
  The Multi 680 supports very large substrates (up to ~680 mm diameter) which are commonly used in optics, mirrors, beam-line components, synchrotron or X-ray optics.
  
  
• Multilayer thin-film coatings: Especially for applications requiring periodic multilayers (e.g., X-ray mirrors, Bragg reflectors, anti-reflective stacks) on large substrates. 
  
  
• High-end manufacturing for niche/large substrates: Because of the ability to handle large and potentially heavy substrates, this tool is suited for production of large optical components rather than just small wafers.