GEMINI

The GEMINI® is a state-of-the-art, fully automated production wafer bonding system, combining wafer-to-wafer alignment and bonding processes in a modular design. Ideal for next-generation MEMS (Micro-Electro-Mechanical Systems) manufacturing up to 300 mm, the GEMINI® excels in wafer-level vacuum or overpressure encapsulation, as well as advanced system integration. As the global industry standard for high-volume manufacturing (HVM), the GEMINI® platform includes up to four bond chambers, ensuring outstanding bond quality and high yield. With full process flexibility, it supports a wide range of bonding techniques, including metal, anodic, glass-frit, fusion, and adhesive bonding, making it a versatile solution for advanced production needs.

Features:

• Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
• Configuration options for bottom-side, IR or SmartView alignment
• Multiple bonding chambers
• Wafer handling system is separated from bond chuck handling system
• Modular design with swap-in modules Combines all benefits from EVG's precision aligners and EVG®500 series systems
• Minimized footprint compared to stand-alone systems
• Optional process modules:
• LowTemp™ plasma activation
• Wafer cleaning
• Coat module UV bond module
• Bake/chill modules
• Alignment verification module

Applications:

• MEMS / Sensor Devices
  Many MEMS require wafer-level sealing, capping, or encapsulation. GEMINI supports large-area, high-yield bonding for MEMS devices. 
  
  
• 3D Integration / Wafer Stacking
  For stacking wafers in 3D-ICs, system-on-chip (SoC) stacking, or heterogeneous integration, GEMINI’s alignment + bonding capabilities are critical.
  
  
• CMOS Image Sensors / Back-Illuminated Sensors
  Fusion bonding and alignment are used in back-side-illuminated (BSI) CMOS sensor fabrication. GEMINI FB variants are used in that domain.
  
  
• Wafer-Level Packaging
  The ability to bond entire wafers with precise alignment supports advanced packaging, including die stacking, interposers, etc.
  
  
• Transition to 300 mm MEMS / Volume Manufacturing
  The newer generation GEMINI systems are aimed at enabling MEMS manufacturers to migrate from 200 mm to 300 mm, scaling economies of scale.
  
  
• Hybrid / Fusion Bonding
  The GEMINI platform includes fusion / hybrid bonding capabilities (e.g. GEMINI FB) with sub-50 nm alignment accuracy, for front-end wafer stacking and 3D integration