Fiji

Our Fiji® series offers a modular, high‑vacuum thermal ALD platform engineered to accommodate diverse deposition requirements. Built on a flexible architecture, it supports multiple precursor and plasma gas configurations to deliver precision and adaptability. The Fiji G2 model represents our next-generation platform, capable of both thermal and plasma-enhanced deposition. Its design benefits from advanced computational fluid dynamics optimisation, fine‑tuning reactor, heater, and trap geometries for consistently reliable performance. An intuitive user interface streamlines recipe monitoring and control, enabling engineers to manage processes with clarity and confidence.

<h3>Technical specifications</h3>

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<td><strong>rational Modes</strong></td>
<td>Continuous Mode™ (Traditional Thermal ALD)<br>Exposure Mode™ (High Aspect Ratio ALD)<br>Plasma Mode™ (Plasma-Enhanced ALD)</td>
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<td><strong>Substrate Size</strong></td>
<td>Up to 200 mm</td>
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<td><strong>Substrate Temperature</strong></td>
<td>500°C 200mm substrate heater standard<br>800°C 100mm substrate heater optional</td>
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<td><strong>Deposition Uniformity</strong></td>
<td>1&nbsp;σ&nbsp;Uniformities<br>Thermal Al₂O₃&nbsp;– 1.5%<br>Plasma Al₂O₃&nbsp;– 1.5%</td>
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<td><strong>Precursors</strong></td>
<td>4 precursor lines standard, up to 6 optional<br>Gas, liquid, or solid precursors individually heatable to 200°C<br>Industry standard high speed ALD valves (10ms minimum pulse time)<br>Widely available 50cc (25mL fill max) stainless steel precursor cylinders</td>
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<td><strong>Gases</strong></td>
<td>100 sccm Ar precursor carrier gas MFC<br>200 sccm Ar plasma gas MFC<br>100 sccm N₂&nbsp;plasma gas MFC<br>100 sccm O₂&nbsp;plasma gas MFC<br>100 sccm H₂&nbsp;plasma gas MFC</td>
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<td><strong>Trap</strong></td>
<td>Integrated, heated, thin foil ALD trap</td>
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<td><strong>Compatibility</strong></td>
<td>Clean Room Class 100 Compatible</td>
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<td><strong>Compliance</strong></td>
<td>CE, TUV, FCC</td>
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<td><strong>Dimensions</strong></td>
<td>F200:<br>1600 x 715 x 1920 mm<br>F200 with load lock:<br>1845 x 715 x 1920 mm</td>
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<td><strong>Power</strong></td>
<td>220-240 VAC, 4200 W per reactor (excludes pump)</td>
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<td><strong>Control</strong></td>
<td>Microsoft Windows™ 7 Laptop PC, LabView based system control</td>
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<td><strong>Vacuum Pump</strong></td>
<td>&gt;50CFM dry pump required<br>Available or customer supplied</td>
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<td><strong>System Options</strong></td>
<td>Spectroscopic Ellipsometer Ports<br>Quartz Crystal Microbalance<br>RGA Port<br>Optical Emission Spectrometer<br>Wafer Plus<br>Ozone Generator<br>Low Vapor Pressure Deposition<br>Glove box Interface<br>Load Lock</td>
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Applications:

• Semiconductor & advanced electronics Deposition of ultra-thin dielectric films, metal nitrides, barrier layers, etc., on up to 200 mm wafers. 
  Research of next-gen devices: e.g., the system was selected by IQM Finland Oy for superconducting film deposition aimed at quantum computing.
  Compound semiconductors and optoelectronics: coupling with MBE for materials like GaN, etc. High aspect-ratio conformal coatings for 3D structures (via ALD exposure & plasma modes) Thus, major segments: logic, memory, power electronics, 3D-integrated devices.
  
  
• Energy storage, battery & renewables At Delft University of Technology the system was used for R&D of materials for energy conversion and storage (solid-state batteries, ultrathin encapsulations) using the Fiji PEALD. Thin film coatings for solar cells, catalysis, water splitting (for example, integrated ALD for novel catalysts and 2D materials) Thus, applications in battery electrodes, electrolytes, encapsulation layers, solar & renewable energy conversion.
  
  
• 2D materials / advanced materials research At University of Michigan, researchers used the Fiji system for synthesis of high-quality 2D MoS₂ films via plasma ALD. Because the system supports solid, liquid or gas precursors, multiple plasma gas lines, glove‐box interface (for air-sensitive processes) and in-situ monitoring.So this tool is very suitable for materials science labs developing next-generation semiconductors, sensors, flexible electronics, photonics.
  
  
• Displays, sensors & optoelectronics Ultra thin, conformal coatings for displays (e.g., barrier layers for flexible displays), sensors (gas, biosensors) and photonic devices (microLEDs, optics) are well suited.For example, the joint MBE+ALD platform targeting microLEDs and photocatalysis for next-gen materials at University of Giessen.
  
  
• Data storage / magnetic materials Although less explicitly cited for Fiji in the public sources I found, ALD tools in general (and Veeco in particular) are used in the data storage industry (e.g., covering magnetic heads, HDDs, magnetic memory). 
  
  
• Encapsulation & protective coatingsALD is increasingly used for ultra-thin protective coatings, barrier films (e.g., for moisture/oxidation protection of electronics and packaging). The Fiji system lists that it supports many oxides, nitrides and metals (Al₂O₃, HfO₂, SiN, TiN, etc) which are relevant for encapsulation.