scia Mill 150

The scia Mill 150 is designed for structuring complex multilayers of various materials. With full reactive gas compatibility, it enables reactive etching processes with enhanced selectivity and rate. Its space-saving design makes it ideal for small-scale production and R&D applications.

Key Features:

• Etching angle adjustment with tiltable and rotatable substrate holder
• Excellent uniformity without shaper
• Enhanced selectivity and rate with reactive gases
• Process control with exact SIMS based or optical end point detection
• Carrier concept for adaptation to variable substrate sizes
• Processing of wafers with photoresist masks due to good wafer cooling