HERCULES

The HERCULES system combines EVG’s renowned optical mask alignment technology with integrated modules for wafer cleaning, resist coating, baking, and resist development. Built on a modular platform, it enables efficient cassette-to-cassette processing for a variety of wafer sizes, including thick, highly bowed, rectangular, and small-diameter wafers, as well as device trays. The system offers precise top-side and bottom-side alignment, with the ability to coat resists ranging from sub-micron to ultra-thick (up to 300 microns), ideal for interlayer and passivation applications. Its superior alignment stage design ensures highly accurate results at high throughput, making the HERCULES a reliable solution for advanced lithography needs.

Features

• Production platform combines all advantages of EVG’s precision alignment and resist processing systems in a minimized footprint
• Versatile platform supports fully automated processing of various substrate shapes, sizes, highly warped mold wafers and even trays
• Coating of up to 52,000 cP enables manufacturing of ultra-thick resist features of up to 300 microns in height
• CoverSpinTM rotating cover for low resist consumption and optimized resist coating uniformity
• OmniSpray® coating for optimized coating of high topography surfaces
• NanoSpray® for coating and protection of via structures Automated mask handling and storage
• Optical edge exposure and/or solvent cleaning for edge bead removal
• Fragile, thin or warped wafer handling of multiple wafer sizes with bridge-tool system
• Rework sorting wafer management and flexible cassette system
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)