GEMINI FB XT

Vertical stacking of semiconductor devices is an increasingly effective approach to advancing device density and performance. Wafer-to-wafer bonding is a critical process enabling 3D stacked devices.The EVG® GEMINI FB XT integrated fusion bonding system pushes the boundaries of current standards, offering higher productivity alongside enhanced alignment and overlay accuracy. It is ideal for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. Equipped with the SmartView bond aligner, the GEMINI FB XT is specifically designed to meet the demanding alignment requirements of fusion and hybrid wafer bonding.

Features

• New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
• Up to six pre-processing modules like:
• Clean module LowTemp™ plasma activation module
• Alignment verification module
• Debond module XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
• Optional features:
• Debond module
• Thermocompression bond module