Skip to the main content.

Join Our Team

We're actively recruiting for a range of roles across sales, engineering, IT and warehouse. Check our careers page to see open positions including apprenticeships. 

View Jobs →

Apprentice_1

 

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

Download Brochure →

Equipment_Move_In_Cleanroom_Flexi_Card

 

GEMINI

The GEMINI® is a state-of-the-art, fully automated production wafer bonding system, combining wafer-to-wafer alignment and bonding processes in a modular design. Ideal for next-generation MEMS (Micro-Electro-Mechanical Systems) manufacturing up to 300 mm, the GEMINI® excels in wafer-level vacuum or overpressure encapsulation, as well as advanced system integration. As the global industry standard for high-volume manufacturing (HVM), the GEMINI® platform includes up to four bond chambers, ensuring outstanding bond quality and high yield. With full process flexibility, it supports a wide range of bonding techniques, including metal, anodic, glass-frit, fusion, and adhesive bonding, making it a versatile solution for advanced production needs.

Features

  • Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
  • Configuration options for bottom-side, IR or SmartView alignment
  • Multiple bonding chambers
  • Wafer handling system is separated from bond chuck handling system
  • Modular design with swap-in modules Combines all benefits from EVG's precision aligners and EVG®500 series systems
  • Minimized footprint compared to stand-alone systems
  • Optional process modules:
  • LowTemp™ plasma activation
  • Wafer cleaning
  • Coat module UV bond module
  • Bake/chill modules
  • Alignment verification module

Speak with one of our experts

Request a callback from one of our team or book a site survey for your project.